Spatial and temporal granularity limits of body biasing in UTBB-FDSOI

Johannes Maximilian Kuhn, Dustin Peterson, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Advances in SOI technology such as STMicro's 28nm UTBB-FDSOI enabled a renaissance of body biasing. Body biasing is a fast and efficient technique to change power and performance characteristics. As the electrical task to change the substrate potential is small compared to Dynamic Voltage Scaling, much finer island sizes are conceivable. This however creates new challenges in regard to design partitioning into body bias islands and body bias combinations across such designs. These combinations should be chosen so that energy efficiency improves while maintaining timing constraints. We introduce a combination based analysis tool to find optimized body bias island partitions and body biasing levels. For such partitions, optimized body bias assignments for static, programmable and dynamic body biasing can be computed. The overheads incurred by dynamically switching body biases are estimated to yield actual improvements and to give an upper bound for the power consumption of required additional circuitry. Based on these partitionings and the switching overheads, optimized application specific switching strategies are computed. The effectiveness of this method is demonstrated in a frequency scaling scenario using forward body biasing on a Dynamic Reconfigurable Processor (DRP) design. We show that leakage can be greatly reduced using the proposed methods and that dynamic body biasing can be beneficial even at small time periods.

Original languageEnglish
Title of host publicationProceedings -Design, Automation and Test in Europe, DATE
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages876-879
Number of pages4
Volume2015-April
ISBN (Print)9783981537048
Publication statusPublished - 2015 Apr 22
Event2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015 - Grenoble, France
Duration: 2015 Mar 92015 Mar 13

Other

Other2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015
CountryFrance
CityGrenoble
Period15/3/915/3/13

Fingerprint

Energy efficiency
Electric power utilization
Substrates
Voltage scaling

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kuhn, J. M., Peterson, D., Amano, H., Bringmann, O., & Rosenstiel, W. (2015). Spatial and temporal granularity limits of body biasing in UTBB-FDSOI. In Proceedings -Design, Automation and Test in Europe, DATE (Vol. 2015-April, pp. 876-879). [7092508] Institute of Electrical and Electronics Engineers Inc..

Spatial and temporal granularity limits of body biasing in UTBB-FDSOI. / Kuhn, Johannes Maximilian; Peterson, Dustin; Amano, Hideharu; Bringmann, Oliver; Rosenstiel, Wolfgang.

Proceedings -Design, Automation and Test in Europe, DATE. Vol. 2015-April Institute of Electrical and Electronics Engineers Inc., 2015. p. 876-879 7092508.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuhn, JM, Peterson, D, Amano, H, Bringmann, O & Rosenstiel, W 2015, Spatial and temporal granularity limits of body biasing in UTBB-FDSOI. in Proceedings -Design, Automation and Test in Europe, DATE. vol. 2015-April, 7092508, Institute of Electrical and Electronics Engineers Inc., pp. 876-879, 2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015, Grenoble, France, 15/3/9.
Kuhn JM, Peterson D, Amano H, Bringmann O, Rosenstiel W. Spatial and temporal granularity limits of body biasing in UTBB-FDSOI. In Proceedings -Design, Automation and Test in Europe, DATE. Vol. 2015-April. Institute of Electrical and Electronics Engineers Inc. 2015. p. 876-879. 7092508
Kuhn, Johannes Maximilian ; Peterson, Dustin ; Amano, Hideharu ; Bringmann, Oliver ; Rosenstiel, Wolfgang. / Spatial and temporal granularity limits of body biasing in UTBB-FDSOI. Proceedings -Design, Automation and Test in Europe, DATE. Vol. 2015-April Institute of Electrical and Electronics Engineers Inc., 2015. pp. 876-879
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