Special issue on 3-D image analysis and modeling

H. Zha; H. Saito; V. Murino; A. Fusiello

doi:10.1109/TSMCB.2003.814779

Special issue on 3-D image analysis and modeling

H. Zha, H. Saito, V. Murino, A. Fusiello

Department of Information and Computer Science

Research output: Contribution to journal › Editorial

1 Citation (Scopus)

Original language	English
Pages (from-to)	550-553
Number of pages	4
Journal	IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics
Volume	33
Issue number	4
DOIs	https://doi.org/10.1109/TSMCB.2003.814779
Publication status	Published - 2003 Aug 1

ASJC Scopus subject areas

Control and Systems Engineering
Software
Information Systems
Human-Computer Interaction
Computer Science Applications
Electrical and Electronic Engineering

Access to Document

10.1109/TSMCB.2003.814779

Cite this

@article{294087af23604af7af599806ab97ca8c,

title = "Special issue on 3-D image analysis and modeling",

author = "H. Zha and H. Saito and V. Murino and A. Fusiello",

year = "2003",

month = aug,

day = "1",

doi = "10.1109/TSMCB.2003.814779",

language = "English",

volume = "33",

pages = "550--553",

journal = "IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics",

issn = "1083-4419",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Special issue on 3-D image analysis and modeling

AU - Zha, H.

AU - Saito, H.

AU - Murino, V.

AU - Fusiello, A.

PY - 2003/8/1

Y1 - 2003/8/1

UR - http://www.scopus.com/inward/record.url?scp=0043268260&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0043268260&partnerID=8YFLogxK

U2 - 10.1109/TSMCB.2003.814779

DO - 10.1109/TSMCB.2003.814779

M3 - Editorial

C2 - 18238204

AN - SCOPUS:0043268260

VL - 33

SP - 550

EP - 553

JO - IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics

JF - IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics

SN - 1083-4419

IS - 4

ER -