Specimen size effect on elastic-plastic strength evaluation of interface between thin films

Chuantong Chen, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A specimen size effect on the adhesion strength of Cu/insulation layer interface was studied by means of a new elastic-plastic finite element simulation technique. By considering the influence of the plastic zone at the interface crack tip, the adhesion strength appeared almost independent of the specimen size. Since the Cu crystals were far smaller than the specimen dimensions and thus no significant difference should be expected in adhesion strength, it is speculated that an accurate estimation of the plastic zone is essential for micro-scale specimen evaluation.

Original languageEnglish
Pages (from-to)371-381
Number of pages11
JournalEngineering Fracture Mechanics
Volume131
DOIs
Publication statusPublished - 2014 Dec 1

Keywords

  • Cu metallization systems
  • Elastic-plastic simulation
  • Local interface strength
  • Size effect

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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    Chen, C., Koiwa, K., Shishido, N., Kamiya, S., Omiya, M., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T., & Nagasawa, T. (2014). Specimen size effect on elastic-plastic strength evaluation of interface between thin films. Engineering Fracture Mechanics, 131, 371-381. https://doi.org/10.1016/j.engfracmech.2014.08.013