Stacking 2D Droplet Arrays for 3D Configurable Droplet Network

Hiroki Yasuga, Toshihisa Osaki, Koki Kamiya, Emre Iseri, Wouter Van Der Wijngaart, Shoji Takeuchi, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Droplet interface bilayer (DIB) networks are expected to lead to tissue-like materials that can be designed from single droplets. Although various functions, such as sensors or computing, have been implemented into DIB networks, there remains a challenge in terms of configurability of constituent droplets in three-dimensional (3D). In this paper, we construct 3D DIB networks with defined droplet positions. We prepared 2D droplet arrays in paper-like substrates based on a method that we previously reported. Vertical stacking of the 2D arrays resulted in DIB formation between layers, i.e., a 3D DIB network.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages387-388
Number of pages2
ISBN (Electronic)9781728116105
DOIs
Publication statusPublished - 2019 Jan
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 2019 Jan 272019 Jan 31

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
CountryKorea, Republic of
CitySeoul
Period19/1/2719/1/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yasuga, H., Osaki, T., Kamiya, K., Iseri, E., Van Der Wijngaart, W., Takeuchi, S., & Miki, N. (2019). Stacking 2D Droplet Arrays for 3D Configurable Droplet Network. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019 (pp. 387-388). [8870863] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2019.8870863