TY - GEN
T1 - Stacking 2D Droplet Arrays for 3D Configurable Droplet Network
AU - Yasuga, Hiroki
AU - Osaki, Toshihisa
AU - Kamiya, Koki
AU - Iseri, Emre
AU - Van Der Wijngaart, Wouter
AU - Takeuchi, Shoji
AU - Miki, Norihisa
N1 - Funding Information:
Hiroki Yasuga was funded through the Grant in Aid for JSPS Research Fellows (Grant Number JP16J06211), Keio University Research Grant for Young Researcher’s Program, and Keio University Doctorate Student Grant-in-Aid Program. Emre Iseri was funded through the European Union’s Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No. 675412.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - Droplet interface bilayer (DIB) networks are expected to lead to tissue-like materials that can be designed from single droplets. Although various functions, such as sensors or computing, have been implemented into DIB networks, there remains a challenge in terms of configurability of constituent droplets in three-dimensional (3D). In this paper, we construct 3D DIB networks with defined droplet positions. We prepared 2D droplet arrays in paper-like substrates based on a method that we previously reported. Vertical stacking of the 2D arrays resulted in DIB formation between layers, i.e., a 3D DIB network.
AB - Droplet interface bilayer (DIB) networks are expected to lead to tissue-like materials that can be designed from single droplets. Although various functions, such as sensors or computing, have been implemented into DIB networks, there remains a challenge in terms of configurability of constituent droplets in three-dimensional (3D). In this paper, we construct 3D DIB networks with defined droplet positions. We prepared 2D droplet arrays in paper-like substrates based on a method that we previously reported. Vertical stacking of the 2D arrays resulted in DIB formation between layers, i.e., a 3D DIB network.
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U2 - 10.1109/MEMSYS.2019.8870863
DO - 10.1109/MEMSYS.2019.8870863
M3 - Conference contribution
AN - SCOPUS:85074326510
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 387
EP - 388
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -