Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation

Chowarit Mitsantisuk, Kiyoshi Ohishi, Shiro Urushihara, Seiichiro Katsura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The development of haptic technology has been a significant trend worldwide. To simulate the virtual environments, several researchers have estimated the parameters of environment in order to interact with human operators. However, the material properties of real environments are greatly influenced by temperature. In this paper, the haptic databased is designed and all of the properties of B-spline curves can be adopted to construct the virtual environments. The order of the curve for the B-spline blending function is set as the natural cubic B-spline. Thus, it is possible to generate a good realization of interaction force and simulate a soft and hard virtual environment according to the material properties. From the experimental results, the proposed mathematical model can be changed the material properties under various condition of temperature.

Original languageEnglish
Title of host publicationInternational Workshop on Advanced Motion Control, AMC
Pages349-354
Number of pages6
DOIs
Publication statusPublished - 2010
Event2010 11th IEEE International Workshop on Advanced Motion Control, AMC2010 - Nagaoka, Niigata, Japan
Duration: 2010 Mar 212010 Mar 24

Other

Other2010 11th IEEE International Workshop on Advanced Motion Control, AMC2010
CountryJapan
CityNagaoka, Niigata
Period10/3/2110/3/24

Fingerprint

Spline Interpolation
Virtual Environments
B-spline
Splines
Material Properties
Virtual reality
Superconducting transition temperature
Stiffness
Materials properties
Interpolation
Haptics
Modeling
Cubic B-spline
B-spline Curve
Mathematical Model
Mathematical models
Temperature
Curve
Experimental Results
Operator

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Modelling and Simulation

Cite this

Mitsantisuk, C., Ohishi, K., Urushihara, S., & Katsura, S. (2010). Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation. In International Workshop on Advanced Motion Control, AMC (pp. 349-354). [5464108] https://doi.org/10.1109/AMC.2010.5464108

Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation. / Mitsantisuk, Chowarit; Ohishi, Kiyoshi; Urushihara, Shiro; Katsura, Seiichiro.

International Workshop on Advanced Motion Control, AMC. 2010. p. 349-354 5464108.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mitsantisuk, C, Ohishi, K, Urushihara, S & Katsura, S 2010, Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation. in International Workshop on Advanced Motion Control, AMC., 5464108, pp. 349-354, 2010 11th IEEE International Workshop on Advanced Motion Control, AMC2010, Nagaoka, Niigata, Japan, 10/3/21. https://doi.org/10.1109/AMC.2010.5464108
Mitsantisuk C, Ohishi K, Urushihara S, Katsura S. Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation. In International Workshop on Advanced Motion Control, AMC. 2010. p. 349-354. 5464108 https://doi.org/10.1109/AMC.2010.5464108
Mitsantisuk, Chowarit ; Ohishi, Kiyoshi ; Urushihara, Shiro ; Katsura, Seiichiro. / Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation. International Workshop on Advanced Motion Control, AMC. 2010. pp. 349-354
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