Stimuli-responsive hydrogel microsprings for multiple and complex actuation

Koki Yoshida, Shunsuke Nakajima, Ryuji Kawano, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes stimuli-responsive hydrogel microsprings (SR springs) for realizing multiple and complex actuation. SR springs, made of double network hydrogel of p(NIPAM-co-AAc) and calcium alginate, were continuously formed by using a bevel-tip capillary. The size, pitch and cross-sectional pattern of SR springs were variable by controlling flow rate, buoyancy force and laminar flow patterns during the spring formation process. By heating single-layered or double-layered SR springs, we achieved five different types of complex spring movements: cross-sectional compression, axial compression, axial expansion, winding up and winding down. We believe that our SR springs could pave the way to various microscale chemomechanical applications such as autonomous soft machines/robots and drug release systems.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages837-840
Number of pages4
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - 2017 Feb 23
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 2017 Jan 222017 Jan 26

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period17/1/2217/1/26

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yoshida, K., Nakajima, S., Kawano, R., & Onoe, H. (2017). Stimuli-responsive hydrogel microsprings for multiple and complex actuation. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 837-840). [7863538] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863538