Stimuli-responsive microfiber-bundle actuator with hierarchical alignment

Shunsuke Nakajima, Ryuji Kawano, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a stimuli-responsive microfiber-bundle actuator that has hierarchical alignment from molecular scale to macroscopic scale. We succeeded in aligning the orientation of molecular scale polymer chains in the stimuli-responsive hydrogel microfiber, which enhances the shrinkage of axial direction of the microfiber. We also bundled the microfibers and constructed a macro-scale bundled microfiber. The actuation of the bundled microfiber was confirmed by stimulating with temperature. We believe that this approach could enhance the performance of functional polymer materials for applications such as biomimetic actuators and soft robots.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages914-917
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Externally publishedYes
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • actuator
  • anisotropic shrinkage
  • microfiber
  • microfluidic spinning
  • Stimuli-responsive hydrogel

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Nakajima, S., Kawano, R., & Onoe, H. (2017). Stimuli-responsive microfiber-bundle actuator with hierarchical alignment. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 914-917). [7994198] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7994198