Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test

Takahiro Asai, Masaaki Aoki, Akihiro Mochizuki, Takamitsu Honjo, Hitoshi Kida, Goro Yoshinari, Nobuhiko Nakano

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)

    Abstract

    Power semiconductor device technology needs highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. This paper reports on 3D thermal stress profile and deformation with multi-physics solver for the system having Ag sintered bonding layer as a new chip attachment technology. The results clarified the reliability properties under thermal cycling test for Ag sintering chip attachment. It was found that the maximum stress value of Ag sintered bonding layer is lower than that of conventional solder layer, and the stress is concentrated at the upper edges for both Ag sintered and conventional solder bonding layers. DCB substrate model where the upper Cu layer thickness is thicker than the lower Cu layer thickness, showed the downward convex warp by the contraction difference between two Cu layers.

    Original languageEnglish
    Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages818-821
    Number of pages4
    ISBN (Electronic)9784904090138
    DOIs
    Publication statusPublished - 2015 May 20
    Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
    Duration: 2015 Apr 142015 Apr 17

    Publication series

    NameICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

    Other

    Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
    CountryJapan
    CityKyoto
    Period15/4/1415/4/17

    Keywords

    • Ag sintering
    • chip attachment
    • multi-physics solver thermal cycling test
    • stress and strain analysis

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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