Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test

Takahiro Asai, Masaaki Aoki, Akihiro Mochizuki, Takamitsu Honjo, Hitoshi Kida, Goro Yoshinari, Nobuhiko Nakano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Power semiconductor device technology needs highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. This paper reports on 3D thermal stress profile and deformation with multi-physics solver for the system having Ag sintered bonding layer as a new chip attachment technology. The results clarified the reliability properties under thermal cycling test for Ag sintering chip attachment. It was found that the maximum stress value of Ag sintered bonding layer is lower than that of conventional solder layer, and the stress is concentrated at the upper edges for both Ag sintered and conventional solder bonding layers. DCB substrate model where the upper Cu layer thickness is thicker than the lower Cu layer thickness, showed the downward convex warp by the contraction difference between two Cu layers.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages818-821
Number of pages4
ISBN (Print)9784904090138
DOIs
Publication statusPublished - 2015 May 20
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 2015 Apr 142015 Apr 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
CountryJapan
CityKyoto
Period15/4/1415/4/17

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Keywords

  • Ag sintering
  • chip attachment
  • multi-physics solver thermal cycling test
  • stress and strain analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Asai, T., Aoki, M., Mochizuki, A., Honjo, T., Kida, H., Yoshinari, G., & Nakano, N. (2015). Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 818-821). [7111124] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111124