Stress Concentration and Profile under Thermal Cycling Test in Power Device Heat Dissipation Structures Using Double-Side Chip Bonding with Ag Sintered Layer on Cu Plate

Kensuke Osonoe, Masaaki Aoki, Takahiro Asai, Yoshio Murakami, Hitoshi Kida, Goro Yoshinari, Nobuhiko Nakano

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