Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

Toshiro Miyoshi; Masaki Shiratori; Hiroshi Okuda; Naoki Takano

Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

Toshiro Miyoshi, Masaki Shiratori, Hiroshi Okuda, Naoki Takano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

Original language	English
Title of host publication	American Society of Mechanical Engineers, EEP
Publisher	Publ by ASME
Pages	551-557
Number of pages	7
ISBN (Print)	0791807665
Publication status	Published - 1992 Dec 1
Externally published	Yes
Event	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: 1992 Apr 9 → 1992 Apr 12

Publication series

Name	American Society of Mechanical Engineers, EEP
Volume	1

Other

Other	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
City	Milpitas, CA, USA
Period	92/4/9 → 92/4/12

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering

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Cite this

Miyoshi, T., Shiratori, M., Okuda, H., & Takano, N. (1992). Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. In American Society of Mechanical Engineers, EEP (pp. 551-557). (American Society of Mechanical Engineers, EEP; Vol. 1). Publ by ASME.

Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. / Miyoshi, Toshiro; Shiratori, Masaki; Okuda, Hiroshi; Takano, Naoki.

American Society of Mechanical Engineers, EEP. Publ by ASME, 1992. p. 551-557 (American Society of Mechanical Engineers, EEP; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Miyoshi, T, Shiratori, M, Okuda, H & Takano, N 1992, Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. in American Society of Mechanical Engineers, EEP. American Society of Mechanical Engineers, EEP, vol. 1, Publ by ASME, pp. 551-557, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2), Milpitas, CA, USA, 92/4/9.

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