TY - GEN

T1 - Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

AU - Miyoshi, Toshiro

AU - Shiratori, Masaki

AU - Okuda, Hiroshi

AU - Takano, Naoki

PY - 1992/12/1

Y1 - 1992/12/1

N2 - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

AB - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

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M3 - Conference contribution

AN - SCOPUS:0027041818

SN - 0791807665

T3 - American Society of Mechanical Engineers, EEP

SP - 551

EP - 557

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)

Y2 - 9 April 1992 through 12 April 1992

ER -