Abstract
From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.
| Original language | English |
|---|---|
| Title of host publication | American Society of Mechanical Engineers, EEP |
| Publisher | Publ by ASME |
| Pages | 551-557 |
| Number of pages | 7 |
| Volume | 1 |
| ISBN (Print) | 0791807665 |
| Publication status | Published - 1992 |
| Externally published | Yes |
| Event | Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: 1992 Apr 9 → 1992 Apr 12 |
Other
| Other | Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) |
|---|---|
| City | Milpitas, CA, USA |
| Period | 92/4/9 → 92/4/12 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
Cite this
Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. / Miyoshi, Toshiro; Shiratori, Masaki; Okuda, Hiroshi; Takano, Naoki.
American Society of Mechanical Engineers, EEP. Vol. 1 Publ by ASME, 1992. p. 551-557.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials
AU - Miyoshi, Toshiro
AU - Shiratori, Masaki
AU - Okuda, Hiroshi
AU - Takano, Naoki
PY - 1992
Y1 - 1992
N2 - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.
AB - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.
UR - http://www.scopus.com/inward/record.url?scp=0027041818&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0027041818&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0027041818
SN - 0791807665
VL - 1
SP - 551
EP - 557
BT - American Society of Mechanical Engineers, EEP
PB - Publ by ASME
ER -