### Abstract

From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

Original language | English |
---|---|

Title of host publication | American Society of Mechanical Engineers, EEP |

Publisher | Publ by ASME |

Pages | 551-557 |

Number of pages | 7 |

Volume | 1 |

ISBN (Print) | 0791807665 |

Publication status | Published - 1992 |

Externally published | Yes |

Event | Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: 1992 Apr 9 → 1992 Apr 12 |

### Other

Other | Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) |
---|---|

City | Milpitas, CA, USA |

Period | 92/4/9 → 92/4/12 |

### Fingerprint

### ASJC Scopus subject areas

- Electrical and Electronic Engineering
- Mechanical Engineering

### Cite this

*American Society of Mechanical Engineers, EEP*(Vol. 1, pp. 551-557). Publ by ASME.

**Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials.** / Miyoshi, Toshiro; Shiratori, Masaki; Okuda, Hiroshi; Takano, Naoki.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

*American Society of Mechanical Engineers, EEP.*vol. 1, Publ by ASME, pp. 551-557, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2), Milpitas, CA, USA, 92/4/9.

}

TY - GEN

T1 - Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

AU - Miyoshi, Toshiro

AU - Shiratori, Masaki

AU - Okuda, Hiroshi

AU - Takano, Naoki

PY - 1992

Y1 - 1992

N2 - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

AB - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

UR - http://www.scopus.com/inward/record.url?scp=0027041818&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027041818&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0791807665

VL - 1

SP - 551

EP - 557

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

ER -