Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

Toshiro Miyoshi, Masaki Shiratori, Hiroshi Okuda, Naoki Takano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages551-557
Number of pages7
Volume1
ISBN (Print)0791807665
Publication statusPublished - 1992
Externally publishedYes
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

Fingerprint

Dissimilar materials
Cracks
Elastic constants
Stress analysis
Stress intensity factors
Crack tips
Thermal expansion
Stress concentration
Finite element method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Miyoshi, T., Shiratori, M., Okuda, H., & Takano, N. (1992). Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. In American Society of Mechanical Engineers, EEP (Vol. 1, pp. 551-557). Publ by ASME.

Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. / Miyoshi, Toshiro; Shiratori, Masaki; Okuda, Hiroshi; Takano, Naoki.

American Society of Mechanical Engineers, EEP. Vol. 1 Publ by ASME, 1992. p. 551-557.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miyoshi, T, Shiratori, M, Okuda, H & Takano, N 1992, Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. in American Society of Mechanical Engineers, EEP. vol. 1, Publ by ASME, pp. 551-557, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2), Milpitas, CA, USA, 92/4/9.
Miyoshi T, Shiratori M, Okuda H, Takano N. Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. In American Society of Mechanical Engineers, EEP. Vol. 1. Publ by ASME. 1992. p. 551-557
Miyoshi, Toshiro ; Shiratori, Masaki ; Okuda, Hiroshi ; Takano, Naoki. / Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials. American Society of Mechanical Engineers, EEP. Vol. 1 Publ by ASME, 1992. pp. 551-557
@inproceedings{ef301f7f07c3461695a13bc55f096348,
title = "Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials",
abstract = "From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.",
author = "Toshiro Miyoshi and Masaki Shiratori and Hiroshi Okuda and Naoki Takano",
year = "1992",
language = "English",
isbn = "0791807665",
volume = "1",
pages = "551--557",
booktitle = "American Society of Mechanical Engineers, EEP",
publisher = "Publ by ASME",

}

TY - GEN

T1 - Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

AU - Miyoshi, Toshiro

AU - Shiratori, Masaki

AU - Okuda, Hiroshi

AU - Takano, Naoki

PY - 1992

Y1 - 1992

N2 - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

AB - From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

UR - http://www.scopus.com/inward/record.url?scp=0027041818&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027041818&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027041818

SN - 0791807665

VL - 1

SP - 551

EP - 557

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

ER -