Study on effect of time parameters of laser shock peening on residual stresses using FE simulation

Ju Hee Kim, Yun Jae Kim, Jong Woo Lee, Sam Hyeon Yoo

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Laser shock peening (LSP) is the newest and most innovative surface treatment technique. LSP residual stress distribution is affected by many parameters. Of them, the parameters are main factors that determine the convergence of finite element analysis (FEA) and characteristic of pressure pulse of laser system. The parameters, related to the convergence of FE simulation, are stability limit time for the stable convergence of results, and solution time for dynamic analysis. The other parameters, related to characteristics of pressure pulse of laser system, are pressure pulse duration time and laser pulse interval time for multiple LSP. In the present work, we have conducted to confirm the influence of time parameters of LSP system on residual stress results using FEA, and we have also predicted optimized range of time parameters.

Original languageEnglish
Pages (from-to)1803-1810
Number of pages8
JournalJournal of Mechanical Science and Technology
Volume28
Issue number5
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes

Fingerprint

Shot peening
Residual stresses
Lasers
Laser pulses
Finite element method
Dynamic analysis
Surface treatment
Stress concentration

Keywords

  • Ablative layer
  • Dynamic yield strength
  • FEA
  • Finite element analysis
  • Infinite element
  • Laser shock peening
  • LSP
  • Plasma
  • Shot peening
  • SP
  • Time parameter
  • Water tamping layer

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Study on effect of time parameters of laser shock peening on residual stresses using FE simulation. / Kim, Ju Hee; Kim, Yun Jae; Lee, Jong Woo; Yoo, Sam Hyeon.

In: Journal of Mechanical Science and Technology, Vol. 28, No. 5, 01.01.2014, p. 1803-1810.

Research output: Contribution to journalArticle

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