Study on fatigue strength characteristics for solder joints

Daisuke Kaneko, Hirotsugu Inoue, Kikuo Kishimoto, Masaki Omiya, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, preventing environmental pollutions, Pb-free solders are about to replace Sn-Pb eutectic solders. Sn-Ag-Cu alloys are leading candidates for Pb-free solders. However, Sn-Ag-Cu alloys were not enough to meet severe board level reliability requirements. In particular, thermal fatigue failure still has the problem. The interfacial strength decreases with intermetallic compounds (IMC) formation between solders and electric pads. Because IMC is brittle, the growth of IMC strongly affects the reliability of solder joints. However, for lead-free solder joints, the effects of IMC layer development on fatigue strength have not been studied well. In this study, in order to inhibit the IMC formation, 6 kinds of nano particles of metal (Cu, Ni, Co, Pt, In, Sb) were added to the solders based on Sn-Ag. We carried out board level fatigue tests and observed and conducted elemental analysis of cross-section surface of solders. And then we considered the relation of the fatigue life of several lead free solder joints and the change of the IMC layer by thermal aging. We aged the specimens in the isothermal chamber under 150°C for 0 to 20 days. As a result of the fatigue tests, about the solder including nickel, the fatigue life after aging is longer and fatigue strength reduction after aging is more lowered than the other solders. And the results of observation showed that IMC layers grow grained and the irregularity of interface between the IMC layers and the solder layers is smaller about the solder including nickel. So we consider that that improves resistance to crack advance, and then the solder showed the higher fatigue strength.

Original languageEnglish
Title of host publicationEMAP 2007 - International Conference on Electronic Materials and Packaging 2007
DOIs
Publication statusPublished - 2007
EventInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007 - Daejeon, Korea, Republic of
Duration: 2007 Nov 192007 Nov 22

Other

OtherInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007
CountryKorea, Republic of
CityDaejeon
Period07/11/1907/11/22

Fingerprint

Soldering alloys
Intermetallics
Fatigue of materials
Aging of materials
Nickel
Fatigue strength
Thermal aging
Thermal fatigue
Eutectics
Pollution
Cracks
Lead-free solders
Metals
Chemical analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kaneko, D., Inoue, H., Kishimoto, K., Omiya, M., & Amagai, M. (2007). Study on fatigue strength characteristics for solder joints. In EMAP 2007 - International Conference on Electronic Materials and Packaging 2007 [4510302] https://doi.org/10.1109/EMAP.2007.4510302

Study on fatigue strength characteristics for solder joints. / Kaneko, Daisuke; Inoue, Hirotsugu; Kishimoto, Kikuo; Omiya, Masaki; Amagai, Masazumi.

EMAP 2007 - International Conference on Electronic Materials and Packaging 2007. 2007. 4510302.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kaneko, D, Inoue, H, Kishimoto, K, Omiya, M & Amagai, M 2007, Study on fatigue strength characteristics for solder joints. in EMAP 2007 - International Conference on Electronic Materials and Packaging 2007., 4510302, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, Daejeon, Korea, Republic of, 07/11/19. https://doi.org/10.1109/EMAP.2007.4510302
Kaneko D, Inoue H, Kishimoto K, Omiya M, Amagai M. Study on fatigue strength characteristics for solder joints. In EMAP 2007 - International Conference on Electronic Materials and Packaging 2007. 2007. 4510302 https://doi.org/10.1109/EMAP.2007.4510302
Kaneko, Daisuke ; Inoue, Hirotsugu ; Kishimoto, Kikuo ; Omiya, Masaki ; Amagai, Masazumi. / Study on fatigue strength characteristics for solder joints. EMAP 2007 - International Conference on Electronic Materials and Packaging 2007. 2007.
@inproceedings{4745f023b9474974b92872e508c88631,
title = "Study on fatigue strength characteristics for solder joints",
abstract = "Recently, preventing environmental pollutions, Pb-free solders are about to replace Sn-Pb eutectic solders. Sn-Ag-Cu alloys are leading candidates for Pb-free solders. However, Sn-Ag-Cu alloys were not enough to meet severe board level reliability requirements. In particular, thermal fatigue failure still has the problem. The interfacial strength decreases with intermetallic compounds (IMC) formation between solders and electric pads. Because IMC is brittle, the growth of IMC strongly affects the reliability of solder joints. However, for lead-free solder joints, the effects of IMC layer development on fatigue strength have not been studied well. In this study, in order to inhibit the IMC formation, 6 kinds of nano particles of metal (Cu, Ni, Co, Pt, In, Sb) were added to the solders based on Sn-Ag. We carried out board level fatigue tests and observed and conducted elemental analysis of cross-section surface of solders. And then we considered the relation of the fatigue life of several lead free solder joints and the change of the IMC layer by thermal aging. We aged the specimens in the isothermal chamber under 150°C for 0 to 20 days. As a result of the fatigue tests, about the solder including nickel, the fatigue life after aging is longer and fatigue strength reduction after aging is more lowered than the other solders. And the results of observation showed that IMC layers grow grained and the irregularity of interface between the IMC layers and the solder layers is smaller about the solder including nickel. So we consider that that improves resistance to crack advance, and then the solder showed the higher fatigue strength.",
author = "Daisuke Kaneko and Hirotsugu Inoue and Kikuo Kishimoto and Masaki Omiya and Masazumi Amagai",
year = "2007",
doi = "10.1109/EMAP.2007.4510302",
language = "English",
isbn = "1424419093",
booktitle = "EMAP 2007 - International Conference on Electronic Materials and Packaging 2007",

}

TY - GEN

T1 - Study on fatigue strength characteristics for solder joints

AU - Kaneko, Daisuke

AU - Inoue, Hirotsugu

AU - Kishimoto, Kikuo

AU - Omiya, Masaki

AU - Amagai, Masazumi

PY - 2007

Y1 - 2007

N2 - Recently, preventing environmental pollutions, Pb-free solders are about to replace Sn-Pb eutectic solders. Sn-Ag-Cu alloys are leading candidates for Pb-free solders. However, Sn-Ag-Cu alloys were not enough to meet severe board level reliability requirements. In particular, thermal fatigue failure still has the problem. The interfacial strength decreases with intermetallic compounds (IMC) formation between solders and electric pads. Because IMC is brittle, the growth of IMC strongly affects the reliability of solder joints. However, for lead-free solder joints, the effects of IMC layer development on fatigue strength have not been studied well. In this study, in order to inhibit the IMC formation, 6 kinds of nano particles of metal (Cu, Ni, Co, Pt, In, Sb) were added to the solders based on Sn-Ag. We carried out board level fatigue tests and observed and conducted elemental analysis of cross-section surface of solders. And then we considered the relation of the fatigue life of several lead free solder joints and the change of the IMC layer by thermal aging. We aged the specimens in the isothermal chamber under 150°C for 0 to 20 days. As a result of the fatigue tests, about the solder including nickel, the fatigue life after aging is longer and fatigue strength reduction after aging is more lowered than the other solders. And the results of observation showed that IMC layers grow grained and the irregularity of interface between the IMC layers and the solder layers is smaller about the solder including nickel. So we consider that that improves resistance to crack advance, and then the solder showed the higher fatigue strength.

AB - Recently, preventing environmental pollutions, Pb-free solders are about to replace Sn-Pb eutectic solders. Sn-Ag-Cu alloys are leading candidates for Pb-free solders. However, Sn-Ag-Cu alloys were not enough to meet severe board level reliability requirements. In particular, thermal fatigue failure still has the problem. The interfacial strength decreases with intermetallic compounds (IMC) formation between solders and electric pads. Because IMC is brittle, the growth of IMC strongly affects the reliability of solder joints. However, for lead-free solder joints, the effects of IMC layer development on fatigue strength have not been studied well. In this study, in order to inhibit the IMC formation, 6 kinds of nano particles of metal (Cu, Ni, Co, Pt, In, Sb) were added to the solders based on Sn-Ag. We carried out board level fatigue tests and observed and conducted elemental analysis of cross-section surface of solders. And then we considered the relation of the fatigue life of several lead free solder joints and the change of the IMC layer by thermal aging. We aged the specimens in the isothermal chamber under 150°C for 0 to 20 days. As a result of the fatigue tests, about the solder including nickel, the fatigue life after aging is longer and fatigue strength reduction after aging is more lowered than the other solders. And the results of observation showed that IMC layers grow grained and the irregularity of interface between the IMC layers and the solder layers is smaller about the solder including nickel. So we consider that that improves resistance to crack advance, and then the solder showed the higher fatigue strength.

UR - http://www.scopus.com/inward/record.url?scp=51249125087&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=51249125087&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2007.4510302

DO - 10.1109/EMAP.2007.4510302

M3 - Conference contribution

AN - SCOPUS:51249125087

SN - 1424419093

SN - 9781424419098

BT - EMAP 2007 - International Conference on Electronic Materials and Packaging 2007

ER -