Surface relief and porous structure patterning of polyimide

Fumiaki Kodera, Yasushi Matsuzawa, Kunihiko Okano, Etsuko Tomiyama, Takashi Yamashita

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Polyimides have excellent properties such as thermo stability, mechanical strength, and chemical stability, which are widely used as the materials for microelectronics and aerospace. We discover the new process of porous structure patterning and surface relief patterning. Porous structure patterning of polyimide is based on poly (amide acid) and photo acid generator (PAG, NAI100). Photo irradiation of the PAA in the presence of PAG induce surface relief grating after thermal imidization. The tone can be controlled using PAG or PBG. The mechanism of the pattern formation is based on the change in imidization temperature by the PAG or PBG.

Original languageEnglish
Pages (from-to)235-240
Number of pages6
JournalJournal of Photopolymer Science and Technology
Volume23
Issue number2
DOIs
Publication statusPublished - 2010 Sep 30

Keywords

  • Photo acid generator
  • Photo base generator
  • Polyimide
  • Porous structure patterning

ASJC Scopus subject areas

  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

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