Swap-And-Randomize: A Method for Building Low-Latency HPC Interconnects

Ikki Fujiwara, Michihiro Koibuchi, Hiroki Matsutani, Henri Casanova

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Random network topologies have been proposed to create low-diameter, low-latency interconnection networks in large-scale computing systems. However, these topologies are difficult to deploy in practice, especially when re-designing existing systems, because they lead to increased total cable length and cable packaging complexity. In this work we propose a new method for creating random topologies without increasing cable length: randomly swap link endpoints in a non-random topology that is already deployed across several cabinets in a machine room. We quantitatively evaluate topologies created in this manner using both graph analysis and cycle-accurate network simulation, including comparisons with non-random topologies and previously-proposed random topologies.

Original languageEnglish
Article number6860278
Pages (from-to)2051-2060
Number of pages10
JournalIEEE Transactions on Parallel and Distributed Systems
Volume26
Issue number7
DOIs
Publication statusPublished - 2015 Jul 1

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Topology
Cables
Packaging

Keywords

  • cabinet layout
  • high-performance computing
  • interconnection networks
  • Network topologies

ASJC Scopus subject areas

  • Hardware and Architecture
  • Signal Processing
  • Computational Theory and Mathematics

Cite this

Swap-And-Randomize : A Method for Building Low-Latency HPC Interconnects. / Fujiwara, Ikki; Koibuchi, Michihiro; Matsutani, Hiroki; Casanova, Henri.

In: IEEE Transactions on Parallel and Distributed Systems, Vol. 26, No. 7, 6860278, 01.07.2015, p. 2051-2060.

Research output: Contribution to journalArticle

Fujiwara, Ikki ; Koibuchi, Michihiro ; Matsutani, Hiroki ; Casanova, Henri. / Swap-And-Randomize : A Method for Building Low-Latency HPC Interconnects. In: IEEE Transactions on Parallel and Distributed Systems. 2015 ; Vol. 26, No. 7. pp. 2051-2060.
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