System integration in a package for cloud and edge

Tadahiro Kuroda

doi:10.1109/EDTM.2017.7947513

System integration in a package for cloud and edge

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

Original language	English
Title of host publication	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	42-43
Number of pages	2
ISBN (Electronic)	9781509046591
DOIs	https://doi.org/10.1109/EDTM.2017.7947513
Publication status	Published - 2017 Jun 13
Event	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan Duration: 2017 Feb 28 → 2017 Mar 2

Publication series

Name	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

Other

Other	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Country/Territory	Japan
City	Toyama
Period	17/2/28 → 17/3/2

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EDTM.2017.7947513

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Kuroda, T. (2017). System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] (2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513

System integration in a package for cloud and edge. / Kuroda, Tadahiro.

2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. p. 42-43 7947513 (2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kuroda, T 2017, System integration in a package for cloud and edge. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings., 7947513, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 42-43, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.7947513

Kuroda T. System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. p. 42-43. 7947513. (2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings). https://doi.org/10.1109/EDTM.2017.7947513

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System integration in a package for cloud and edge

Abstract

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ASJC Scopus subject areas

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