System integration in a package for cloud and edge

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

    Original languageEnglish
    Title of host publication2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages42-43
    Number of pages2
    ISBN (Electronic)9781509046591
    DOIs
    Publication statusPublished - 2017 Jun 13
    Event2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
    Duration: 2017 Feb 282017 Mar 2

    Other

    Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
    CountryJapan
    CityToyama
    Period17/2/2817/3/2

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Kuroda, T. (2017). System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513