TY - GEN
T1 - System integration in a package for cloud and edge
AU - Kuroda, Tadahiro
N1 - Funding Information:
This work was supported by JST.
Publisher Copyright:
© 2017 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/6/13
Y1 - 2017/6/13
N2 - Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.
AB - Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.
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U2 - 10.1109/EDTM.2017.7947513
DO - 10.1109/EDTM.2017.7947513
M3 - Conference contribution
AN - SCOPUS:85021878667
T3 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
SP - 42
EP - 43
BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Y2 - 28 February 2017 through 2 March 2017
ER -