System integration in a package for cloud and edge

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

Original languageEnglish
Title of host publication2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages42-43
Number of pages2
ISBN (Electronic)9781509046591
DOIs
Publication statusPublished - 2017 Jun 13
Event2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
Duration: 2017 Feb 282017 Mar 2

Other

Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
CountryJapan
CityToyama
Period17/2/2817/3/2

Fingerprint

Cloud computing
Integrated circuits
Electric lines
Sensors
Internet of things

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kuroda, T. (2017). System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513

System integration in a package for cloud and edge. / Kuroda, Tadahiro.

2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. p. 42-43 7947513.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2017, System integration in a package for cloud and edge. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings., 7947513, Institute of Electrical and Electronics Engineers Inc., pp. 42-43, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.7947513
Kuroda T. System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. p. 42-43. 7947513 https://doi.org/10.1109/EDTM.2017.7947513
Kuroda, Tadahiro. / System integration in a package for cloud and edge. 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 42-43
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