Abstract
Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.
| Original language | English |
|---|---|
| Title of host publication | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 42-43 |
| Number of pages | 2 |
| ISBN (Electronic) | 9781509046591 |
| DOIs | |
| Publication status | Published - 2017 Jun 13 |
| Event | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan Duration: 2017 Feb 28 → 2017 Mar 2 |
Other
| Other | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 |
|---|---|
| Country | Japan |
| City | Toyama |
| Period | 17/2/28 → 17/3/2 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
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Cite this
Kuroda, T. (2017). System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513