System integration in a package for cloud and edge

Tadahiro Kuroda

doi:10.1109/EDTM.2017.7947513

System integration in a package for cloud and edge

Tadahiro Kuroda

Department of Electronics and Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

Original language	English
Title of host publication	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	42-43
Number of pages	2
ISBN (Electronic)	9781509046591
DOIs	https://doi.org/10.1109/EDTM.2017.7947513
Publication status	Published - 2017 Jun 13
Event	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan Duration: 2017 Feb 28 → 2017 Mar 2

Other

Other	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Country	Japan
City	Toyama
Period	17/2/28 → 17/3/2

Fingerprint

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Kuroda, T. (2017). System integration in a package for cloud and edge. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513

Kuroda, T 2017, System integration in a package for cloud and edge. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings., 7947513, Institute of Electrical and Electronics Engineers Inc., pp. 42-43, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.7947513

@inproceedings{1553f8555d524cf6b21992742d1e4ef2,

title = "System integration in a package for cloud and edge",

abstract = "Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.",

author = "Tadahiro Kuroda",

year = "2017",

month = "6",

day = "13",

doi = "10.1109/EDTM.2017.7947513",

language = "English",

pages = "42--43",

booktitle = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 ; Conference date: 28-02-2017 Through 02-03-2017",

}

TY - GEN

T1 - System integration in a package for cloud and edge

AU - Kuroda, Tadahiro

PY - 2017/6/13

Y1 - 2017/6/13

N2 - Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

AB - Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

UR - http://www.scopus.com/inward/record.url?scp=85021878667&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85021878667&partnerID=8YFLogxK

U2 - 10.1109/EDTM.2017.7947513

DO - 10.1109/EDTM.2017.7947513

M3 - Conference contribution

AN - SCOPUS:85021878667

SP - 42

EP - 43

BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017

Y2 - 28 February 2017 through 2 March 2017

ER -

Access to Document

10.1109/EDTM.2017.7947513