Abstract
The conventional thermal design process for consumer electronics focusing exclusively on hardware is becoming insufficient for limiting thermal risk in the market. This study uses system modeling language (SysML) and a multipledomain matrix (MDM) to examine the thermal design process at the system level, which comprises both hardware and software. The entire thermal design process is visualized using an MDM comprising design structure matrices for the function, performance, and structure of a product and the correlations between them. It is demonstrated through the trade-off study of image processor selection and a machine design that our proposed thermal design process can lead better product specifications in terms of thermal performance and parts cost.
| Original language | English |
|---|---|
| Title of host publication | Modeling and Managing Complex Systems - Proceedings of the 17th International DSM Conference |
| Publisher | Carl Hanser Verlag |
| Pages | 149-159 |
| Number of pages | 11 |
| ISBN (Print) | 9783446445734 |
| Publication status | Published - 2015 |
| Event | 17th International Dependency and Structure Modeling Conference, DSM 2015 - Fort Worth, United States Duration: 2015 Nov 4 → 2015 Nov 6 |
Other
| Other | 17th International Dependency and Structure Modeling Conference, DSM 2015 |
|---|---|
| Country/Territory | United States |
| City | Fort Worth |
| Period | 15/11/4 → 15/11/6 |
Keywords
- Consumer product
- Design structure matrix
- Domain mapping matrix
- Multiple-domain matrix
- Software design
- Thermal design
ASJC Scopus subject areas
- Artificial Intelligence
- Management of Technology and Innovation
- Software
- Computational Mathematics