System level thermal design-process modeling for functional/structure design using SysML and MDM

Kenichi Seki, Yoshio Muraoka, Hidekazu Nishimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The conventional thermal design process for consumer electronics focusing exclusively on hardware is becoming insufficient for limiting thermal risk in the market. This study uses system modeling language (SysML) and a multipledomain matrix (MDM) to examine the thermal design process at the system level, which comprises both hardware and software. The entire thermal design process is visualized using an MDM comprising design structure matrices for the function, performance, and structure of a product and the correlations between them. It is demonstrated through the trade-off study of image processor selection and a machine design that our proposed thermal design process can lead better product specifications in terms of thermal performance and parts cost.

Original languageEnglish
Title of host publicationModeling and Managing Complex Systems - Proceedings of the 17th International DSM Conference
PublisherCarl Hanser Verlag
Pages149-159
Number of pages11
ISBN (Print)9783446445734
Publication statusPublished - 2015
Event17th International Dependency and Structure Modeling Conference, DSM 2015 - Fort Worth, United States
Duration: 2015 Nov 42015 Nov 6

Other

Other17th International Dependency and Structure Modeling Conference, DSM 2015
CountryUnited States
CityFort Worth
Period15/11/415/11/6

Keywords

  • Consumer product
  • Design structure matrix
  • Domain mapping matrix
  • Multiple-domain matrix
  • Software design
  • Thermal design

ASJC Scopus subject areas

  • Artificial Intelligence
  • Management of Technology and Innovation
  • Software
  • Computational Mathematics

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