Temperature control for thermal sensation based on thermal diffusion equation

Yukiko Osawa, Seiichiro Katsura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Technique of rendering thermal sensation can connect people who are in remote locations, such as teletherapy and a multimodal system. Humans feel detailed temperature distribution and recognize the characteristic of a contacting object. Although, conventional method can only render the thermal sensation of a fingertip or a part of a hand. In the case of combining these techniques with robot for human support, the robot can only touch one point of a material. This paper proposed the method of temperature control for rendering thermal sensation considering spatial diffusion. The method can spread the area of rendering and help rendering spatial sensations. The validity of the proposed method is verified through some experiments.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE 25th International Symposium on Industrial Electronics, ISIE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1264-1269
Number of pages6
Volume2016-November
ISBN (Electronic)9781509008735
DOIs
Publication statusPublished - 2016 Nov 15
Event25th IEEE International Symposium on Industrial Electronics, ISIE 2016 - Santa Clara, United States
Duration: 2016 Jun 82016 Jun 10

Other

Other25th IEEE International Symposium on Industrial Electronics, ISIE 2016
CountryUnited States
CitySanta Clara
Period16/6/816/6/10

Keywords

  • Distributed parameter system
  • Peltier device
  • Temperature control
  • Thermal diffusion equation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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  • Cite this

    Osawa, Y., & Katsura, S. (2016). Temperature control for thermal sensation based on thermal diffusion equation. In Proceedings - 2016 IEEE 25th International Symposium on Industrial Electronics, ISIE 2016 (Vol. 2016-November, pp. 1264-1269). [7745076] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISIE.2016.7745076