The matching of lead underwriters and issuing firms in the Japanese corporate bond market

Colin R Mckenzie, Sumiko Takaoka

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The purpose of this paper is to examine the role of reputation in the matching of lead underwriters and issuing firms in the straight corporate bond market in Japan. While the existing literature already investigates how the issuing firm chooses its lead underwriter at the time of issue, this paper uses successive issues of straight corporate bonds to examine how the matching of lead underwriters and issuing firms changes over time. Data on individual issues of straight corporate bonds publicly issued in Japan between 25 February 1994 and 31 December 2009 are used to estimate models which explain how issuing firms match with lead underwriters. We measure the reputations of underwriters and issuing firms using each underwriter's percentile rank in the underwriting market and the issuer's percentile rank in the issuing proceeds, respectively. We construct a data set of straight corporate bond issues which includes many repeated issues. One of the contributions in this paper is to take account of these repeated issues by treating the data as a panel data set, and allowing for an issuer random effect in both probit and logit models of switching. This random effect is found to be significant. The estimation results show that issuing firms match with the same lead underwriter when the difference of the issuer's reputation and the current reputation of the previous lead underwriter is small. Issuing firms with an AAA rating at the time of issue are less likely to match with the same lead underwriters. In addition to reputation effects, there is strong evidence to suggest that issuing firms continue to stay matched with the same underwriter if the lead underwriter is a subsidiary of the issuing firm's main bank.

Original languageEnglish
Pages (from-to)86-97
Number of pages12
JournalMathematics and Computers in Simulation
Volume93
DOIs
Publication statusPublished - 2013

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Lead
Straight
Percentile
Random Effects
Japan
Business
Market
Financial markets
Probit Model
Logit Model
Panel Data
Continue
Choose
Likely
Reputation
Estimate

Keywords

  • Corporate bonds
  • Japan
  • Matching
  • Reputation
  • Underwriter

ASJC Scopus subject areas

  • Theoretical Computer Science
  • Computer Science(all)
  • Numerical Analysis
  • Modelling and Simulation
  • Applied Mathematics

Cite this

The matching of lead underwriters and issuing firms in the Japanese corporate bond market. / Mckenzie, Colin R; Takaoka, Sumiko.

In: Mathematics and Computers in Simulation, Vol. 93, 2013, p. 86-97.

Research output: Contribution to journalArticle

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