THEMIS: Context-Sensitive Similarity Analysis for Wound Imagery Using Mathematical Model of Meaning

Yume Asayama, Baoqing Wang, Masanori Nakayama, Hideki Shohjoh, Noboru Adachi, Yasushi Kiyoki, Issei Fujishiro

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Even when generated with the same weapon, a wound's appearance would be affected by its use and the assaulter's physique. In contrast, even if wounds look similar in shape and/or color, they could have a different wounding history. In this work, we strive to extract the features of shape and color from a given wound image and build on the mathematical model of meaning to create the associated semantics of the criminal act. We demonstrate that a system called THEMIS (theoretical estimation of the meaning of insults) provides a context-sensitive visual similarity analysis for wound imagery in computational forensics. The THEMIS system can help forensic doctors and e-court stakeholders potentially determine important aspects of a case through a comparison with wounds of corpses in past cases, in a way that is not currently possible.

Original languageEnglish
Title of host publicationProceedings - 2021 International Conference on Cyberworlds, CW 2021
EditorsAlexei Sourin, Christophe Rosenberger, Olga Sourina
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages129-132
Number of pages4
ISBN (Electronic)9781665440653
DOIs
Publication statusPublished - 2021
Event2021 International Conference on Cyberworlds, CW 2021 - Caen, France
Duration: 2021 Sep 282021 Sep 30

Publication series

NameProceedings - 2021 International Conference on Cyberworlds, CW 2021

Conference

Conference2021 International Conference on Cyberworlds, CW 2021
Country/TerritoryFrance
CityCaen
Period21/9/2821/9/30

Keywords

  • computational forensics
  • content-based image retrieval
  • semantic computing
  • similarity search

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Vision and Pattern Recognition
  • Media Technology
  • Modelling and Simulation

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