Theoretical approach on the critical depth of cut of single crystal MgF2 and application to a microcavity

Yuka Hayama, Shun Fujii, Takasumi Tanabe, Yasuhiro Kakinuma

Research output: Contribution to journalArticlepeer-review

Abstract

Optical microcavity, which can localize light at a certain spot for a short period of time, has a wide range of applications, such as optical signal processing and optical frequency combs. Single crystal CaF2 has excellent optical properties and many research on the manufacturing process to create a microcavity has been done. However, due to its unstable thermal conditions, stable oscillation of Kerr comb could not be done. Single crystal MgF2, which also has excellent optical properties, has stable thermal conditions suitable to create a microcavity. Like CaF2, MgF2 microcavity can only be manufactured by ultra-precision cylindrical turning, yet its appropriate processing conditions is not known. In this study, a method to derive the critical depth of cut theoretically in ductile mode machining was proposed in consideration of specific cutting energy, mechanical properties and slip system of workpiece, and tool geometry. The critical depth of cut calculated by the proposed method roughly agreed with the experimental value on the MgF2 plane. Unlike CaF2, MgF2 has an optical anisotropy; therefore, in order to create a microcavity where the refractive angle is constant, the resonance part needs to be made on a cylinder with (001) plane as end face. Therefore, a microcavity was fabricated according to the critical depth of cut on a cylinder with (001) as end face derived from the proposed method, and the surface integrity was evaluated from the viewpoint of microcavity performance.

Original languageEnglish
Pages (from-to)234-243
Number of pages10
JournalPrecision Engineering
Volume73
DOIs
Publication statusPublished - 2022 Jan

Keywords

  • Brittle-ductile transition
  • Crystal anisotropy
  • Optical microcavity
  • Orthogonal cutting
  • Resolved shear stress model
  • Ultra-precision machining

ASJC Scopus subject areas

  • Engineering(all)

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