Thermal analysis of laser irradiation of fused silica

Peng Yao, Yadong Gong, Suoxian Yuan, Tianfeng Zhou, Jiwang Yan, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.

Original languageEnglish
Title of host publicationAdvanced Manufacturing Technology
Pages1960-1964
Number of pages5
DOIs
Publication statusPublished - 2011 Sep 26
Externally publishedYes
Event2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011 - Guangzhou, China
Duration: 2011 Sep 162011 Sep 18

Publication series

NameAdvanced Materials Research
Volume314-316
ISSN (Print)1022-6680

Other

Other2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011
CountryChina
CityGuangzhou
Period11/9/1611/9/18

Keywords

  • CO laser irradiation
  • Fused silica
  • Repair
  • Single pass scan
  • Surface and subsurface micro cracks
  • Thermal analysis

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Yao, P., Gong, Y., Yuan, S., Zhou, T., Yan, J., & Kuriyagawa, T. (2011). Thermal analysis of laser irradiation of fused silica. In Advanced Manufacturing Technology (pp. 1960-1964). (Advanced Materials Research; Vol. 314-316). https://doi.org/10.4028/www.scientific.net/AMR.314-316.1960