Thermal emission rates and capture cross sections of majority carriers at vanadium centers in silicon

Eiji Ohta, Makoto Sakata

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The thermal emission rates and capture cross sections of majority carriers on the vandium associated centers in the depletion region of reverse biased silicon p-n junctions have been measured by the dark capacitance transient method. The three vanduim associated levels observed, two donor levels and a deep acceptor level, belong to the same vandium center. Least square fits of the emission data give the following emission rates; enlt = 1.047 × 106T2 exp [−0.179±0.004 eV/kT], en0t = 3.55 × 107T2 exp [−0.426±0.004 eV/kT] and ep-2t = 1.514 × 106T2 exp [−0.450±0.003 eV/kT]. The activation energy of the hole emission rate at the lower donor level is about 0.1 eV larger than the equilibrium thermal activation energy. The capture cross sections are σn0 = 3 × 10−17cm2 and σp0 = 8 × 10−16cm2 for the electron capture process at the deep acceptor level and the hole capture process at the upper donor level, respectively. The hole capture cross section on the lower donor level (σp-1) depends significantly on temperature. The large temperature dependence of the hole capture cross section can be expected due to the nonradiative multiphonon emission process.

Original languageEnglish
Pages (from-to)759-764
Number of pages6
JournalSolid-State Electronics
Issue number7
Publication statusPublished - 1980 Jan 1


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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