Thermal management of software changes in product lifecycle of consumer electronics

Yoshio Muraoka, Hidekazu Nishimura, Kenichi Seki

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.

Original languageEnglish
Pages (from-to)237-246
Number of pages10
JournalIFIP Advances in Information and Communication Technology
Volume442
Publication statusPublished - 2014 Jan 1

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Keywords

  • Collab-orative design
  • Electronic products
  • Embedded system
  • Low-temperature burn injury
  • Product lifecycle management
  • Simulation
  • Software change
  • SysML
  • System level
  • Thermal design

ASJC Scopus subject areas

  • Information Systems
  • Computer Networks and Communications
  • Information Systems and Management

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