Thermal management of software changes in product lifecycle of consumer electronics

Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura

Research output: Contribution to journalArticle

Abstract

The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

Original languageEnglish
Pages (from-to)348-362
Number of pages15
JournalInternational Journal of Product Lifecycle Management
Volume8
Issue number4
DOIs
Publication statusPublished - 2015

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Keywords

  • Collaborative design
  • Electronic products
  • Embedded system
  • Low-temperature burn injury
  • Product lifecycle management
  • Simulation
  • Software change
  • Sysml
  • System level
  • Thermal design

ASJC Scopus subject areas

  • Business and International Management
  • Safety, Risk, Reliability and Quality
  • Management Science and Operations Research

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