Thermal management of software changes in product lifecycle of consumer electronics

Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura

Research output: Contribution to journalArticle

Abstract

The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

Original languageEnglish
Pages (from-to)348-362
Number of pages15
JournalInternational Journal of Product Lifecycle Management
Volume8
Issue number4
DOIs
Publication statusPublished - 2015

Fingerprint

Consumer electronics
Temperature control
Electric power utilization
Hardware
Hot Temperature
Product lifecycle
Software

Keywords

  • Collaborative design
  • Electronic products
  • Embedded system
  • Low-temperature burn injury
  • Product lifecycle management
  • Simulation
  • Software change
  • Sysml
  • System level
  • Thermal design

ASJC Scopus subject areas

  • Business and International Management
  • Safety, Risk, Reliability and Quality
  • Management Science and Operations Research

Cite this

Thermal management of software changes in product lifecycle of consumer electronics. / Muraoka, Yoshio; Seki, Kenichi; Nishimura, Hidekazu.

In: International Journal of Product Lifecycle Management, Vol. 8, No. 4, 2015, p. 348-362.

Research output: Contribution to journalArticle

@article{98a26e097a2640d4a2e14acd7e4801a5,
title = "Thermal management of software changes in product lifecycle of consumer electronics",
abstract = "The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.",
keywords = "Collaborative design, Electronic products, Embedded system, Low-temperature burn injury, Product lifecycle management, Simulation, Software change, Sysml, System level, Thermal design",
author = "Yoshio Muraoka and Kenichi Seki and Hidekazu Nishimura",
year = "2015",
doi = "10.1504/IJPLM.2015.075931",
language = "English",
volume = "8",
pages = "348--362",
journal = "International Journal of Product Lifecycle Management",
issn = "1743-5110",
publisher = "Inderscience Enterprises Ltd",
number = "4",

}

TY - JOUR

T1 - Thermal management of software changes in product lifecycle of consumer electronics

AU - Muraoka, Yoshio

AU - Seki, Kenichi

AU - Nishimura, Hidekazu

PY - 2015

Y1 - 2015

N2 - The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

AB - The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

KW - Collaborative design

KW - Electronic products

KW - Embedded system

KW - Low-temperature burn injury

KW - Product lifecycle management

KW - Simulation

KW - Software change

KW - Sysml

KW - System level

KW - Thermal design

UR - http://www.scopus.com/inward/record.url?scp=84970976470&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84970976470&partnerID=8YFLogxK

U2 - 10.1504/IJPLM.2015.075931

DO - 10.1504/IJPLM.2015.075931

M3 - Article

VL - 8

SP - 348

EP - 362

JO - International Journal of Product Lifecycle Management

JF - International Journal of Product Lifecycle Management

SN - 1743-5110

IS - 4

ER -