Thermal/acoustic trade-off design for consumer electronics in a distributed design environment

Kenichi Seki, Hidekazu Nishimura, Kosuke Ishii, Laurent Balmelli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Today's market demand for smaller, more powerful consumer electronics poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination amongst different stakeholders within the enterprise increasingly becomes an important criterion to enable global engineering. We begin the paper with an introduction to a typical design process involving distributed design teams In particular the process allows the thermal-acoustic design of cavities, i.e. air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then we proceed with the investigation of an approach leveraging recent modelling technology to support such a process efficiently. The process makes use of the system modelling language (SysML.) as product description support and the Design Structure Matrix as an analytical design tool. We use the model and the DSM as a means to drive numerical simulation and perform trade-off studies. Simulation results show that performing trade-off study in the early system design phase leads to a potentially optimal module layout for the problem studied.

Original languageEnglish
Title of host publication19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009
Pages1126-1138
Number of pages13
Volume3
Publication statusPublished - 2009
Event19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009 - , Singapore
Duration: 2009 Jul 202009 Jul 23

Other

Other19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009
CountrySingapore
Period09/7/2009/7/23

Fingerprint

Consumer electronics
Acoustics
Enclosures
Hot Temperature
Systems analysis
Flow rate
Radiation
Computer simulation
Air
Industry

ASJC Scopus subject areas

  • Hardware and Architecture
  • Information Systems
  • Control and Systems Engineering

Cite this

Seki, K., Nishimura, H., Ishii, K., & Balmelli, L. (2009). Thermal/acoustic trade-off design for consumer electronics in a distributed design environment. In 19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009 (Vol. 3, pp. 1126-1138)

Thermal/acoustic trade-off design for consumer electronics in a distributed design environment. / Seki, Kenichi; Nishimura, Hidekazu; Ishii, Kosuke; Balmelli, Laurent.

19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009. Vol. 3 2009. p. 1126-1138.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Seki, K, Nishimura, H, Ishii, K & Balmelli, L 2009, Thermal/acoustic trade-off design for consumer electronics in a distributed design environment. in 19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009. vol. 3, pp. 1126-1138, 19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009, Singapore, 09/7/20.
Seki K, Nishimura H, Ishii K, Balmelli L. Thermal/acoustic trade-off design for consumer electronics in a distributed design environment. In 19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009. Vol. 3. 2009. p. 1126-1138
Seki, Kenichi ; Nishimura, Hidekazu ; Ishii, Kosuke ; Balmelli, Laurent. / Thermal/acoustic trade-off design for consumer electronics in a distributed design environment. 19th Annual International Symposium of the International Council on Systems Engineering, INCOSE 2009. Vol. 3 2009. pp. 1126-1138
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