Three-dimensional packaging structure for 3D-NoC

Kikuo Wada, Shigekazu Hino, Nobuyuki Yamasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we propose a novel three-dimensional (3D) packaging structure for a network-on-chip (NoC) based a 3D system-on-chip (SoC). Our SiP is implemented by vertically connecting two homogeneous SoCs through an organic interposer; that is, two homogeneous SoCs are bonded face-to-face above and below the organic interposer. NoCs have routing capability that can communicate with each other even if opposing nodes are connected to different node pins, which enables high-speed communication between SoCs using low voltage and current. As the power supply and external I/O pins are implemented via the organic interposer, we performed simulations to assess power integrity (PI) and signal integrity (SI) compared to a conventional package. To assess vertical communication performance as a 3D package, we simulated high-speed characteristics using the organic interposer and through silicon vias (TSVs), and confirmed the superior performance of the organic interposer.

Original languageEnglish
Title of host publicationEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages72-75
Number of pages4
DOIs
Publication statusPublished - 2013
Event2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan
Duration: 2013 Dec 122013 Dec 15

Other

Other2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
CountryJapan
CityNara
Period13/12/1213/12/15

Fingerprint

Packaging
Communication
Silicon
Electric potential
Network-on-chip
System-in-package
System-on-chip

Keywords

  • 3D-LSI
  • 3D-SiP
  • FFCSP
  • NoC

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wada, K., Hino, S., & Yamasaki, N. (2013). Three-dimensional packaging structure for 3D-NoC. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 72-75). [6724392] https://doi.org/10.1109/EDAPS.2013.6724392

Three-dimensional packaging structure for 3D-NoC. / Wada, Kikuo; Hino, Shigekazu; Yamasaki, Nobuyuki.

EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 72-75 6724392.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wada, K, Hino, S & Yamasaki, N 2013, Three-dimensional packaging structure for 3D-NoC. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724392, pp. 72-75, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, Japan, 13/12/12. https://doi.org/10.1109/EDAPS.2013.6724392
Wada K, Hino S, Yamasaki N. Three-dimensional packaging structure for 3D-NoC. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 72-75. 6724392 https://doi.org/10.1109/EDAPS.2013.6724392
Wada, Kikuo ; Hino, Shigekazu ; Yamasaki, Nobuyuki. / Three-dimensional packaging structure for 3D-NoC. EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. pp. 72-75
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