Abstract
This paper presents work on integrating wireless 3-D interconnection interface, namely ThruChip Interface (TCI), in three-dimensional field-programmable gate array (3-D FPGA) exploration tool (TPR). TCI is an emerging 3-D IC integration solution because of its advantages over cost, flexibility, reliability, comparable performance, and energy dissipation in comparison to through-silicon-via (TSV). Since the communication bandwidth of TCI is much higher than FPGA internal logic signals, in order to fully utilize its bandwidth, the time-division multiplexing (TDM) scheme is adopted. The experimental results show 25% on average and 58% at maximum path delay reduction over 2-D FPGA when five layers are used in TCI based 3-D FPGA architecture. Although the performance of TCI based 3-D FPGA architecture is 8% below that of TSV based 3-D FPGA on average, TCI based architecture can reduce active area consumed by vertical communication channels by 42% on average in comparison to TSV based architecture and hence leads to better delay and area product.
Original language | English |
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Pages (from-to) | 288-297 |
Number of pages | 10 |
Journal | IEICE Transactions on Electronics |
Volume | E98C |
Issue number | 4 |
DOIs | |
Publication status | Published - 2015 Apr 1 |
Keywords
- 3-DFPGA
- FPGA
- TCI
- TPR
- TSV
- ThruChip
- VPR
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering