Thruchip interface for heterogeneous chip stacking

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is much less expensive than TSV (Through Silicon Via) but bears comparison in performance. Delay time and energy dissipation will scale down by scaling device size and chip thickness. As the inductive coupling enables interface among chips under different supply voltages, TCI is suitable for heterogeneous integration. A 90nm 8- core processor under 1.0V power supply and two 65nm SRAM's under 1.2V power supply are stacked and AC-coupled by TCI at 19.2Gb/s. Power dissipation and area efficiency of the link is 1pJ/b and 0.15mm2/Gbps respectively, which is 1/30 and 1/3 in comparison with the conventional DDR2 interface.

Original languageEnglish
Title of host publicationECS Transactions
Pages63-68
Number of pages6
Volume50
Edition14
DOIs
Publication statusPublished - 2012
EventSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012 - Honolulu, HI, United States
Duration: 2012 Oct 72012 Oct 12

Other

OtherSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012
CountryUnited States
CityHonolulu, HI
Period12/10/712/10/12

Fingerprint

Energy dissipation
Static random access storage
Interfaces (computer)
Telecommunication links
Time delay
Silicon
Networks (circuits)
Electric potential

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Thruchip interface for heterogeneous chip stacking. / Kuroda, Tadahiro.

ECS Transactions. Vol. 50 14. ed. 2012. p. 63-68.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2012, Thruchip interface for heterogeneous chip stacking. in ECS Transactions. 14 edn, vol. 50, pp. 63-68, Symposium on More than Moore - 222nd ECS Meeting/PRiME 2012, Honolulu, HI, United States, 12/10/7. https://doi.org/10.1149/05014.0063ecst
Kuroda, Tadahiro. / Thruchip interface for heterogeneous chip stacking. ECS Transactions. Vol. 50 14. ed. 2012. pp. 63-68
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