ThruChip Interface (TCI) for 3D integration of low-power system

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.

    Original languageEnglish
    Title of host publication2010 IEEE International Electron Devices Meeting, IEDM 2010
    Pages17.1.1
    DOIs
    Publication statusPublished - 2010 Dec 1
    Event2010 IEEE International Electron Devices Meeting, IEDM 2010 - San Francisco, CA, United States
    Duration: 2010 Dec 62010 Dec 8

    Publication series

    NameTechnical Digest - International Electron Devices Meeting, IEDM
    ISSN (Print)0163-1918

    Other

    Other2010 IEEE International Electron Devices Meeting, IEDM 2010
    CountryUnited States
    CitySan Francisco, CA
    Period10/12/610/12/8

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

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  • Cite this

    Kuroda, T. (2010). ThruChip Interface (TCI) for 3D integration of low-power system. In 2010 IEEE International Electron Devices Meeting, IEDM 2010 (pp. 17.1.1). [5703378] (Technical Digest - International Electron Devices Meeting, IEDM). https://doi.org/10.1109/IEDM.2010.5703378