ThruChip interface (TCI) for 3D networks on chip

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)

    Abstract

    This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.

    Original languageEnglish
    Title of host publication2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
    Pages238-241
    Number of pages4
    DOIs
    Publication statusPublished - 2011 Dec 22
    Event2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong
    Duration: 2011 Oct 32011 Oct 5

    Publication series

    Name2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011

    Other

    Other2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
    CountryHong Kong
    CityKowloon
    Period11/10/311/10/5

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Kuroda, T. (2011). ThruChip interface (TCI) for 3D networks on chip. In 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 (pp. 238-241). [6081644] (2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011). https://doi.org/10.1109/VLSISoC.2011.6081644