ThruChip interface (TCI) for 3D networks on chip

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.

Original languageEnglish
Title of host publication2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Pages238-241
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong
Duration: 2011 Oct 32011 Oct 5

Other

Other2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
CountryHong Kong
CityKowloon
Period11/10/311/10/5

Fingerprint

Digital circuits
Energy dissipation
Costs
Network-on-chip

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kuroda, T. (2011). ThruChip interface (TCI) for 3D networks on chip. In 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 (pp. 238-241). [6081644] https://doi.org/10.1109/VLSISoC.2011.6081644

ThruChip interface (TCI) for 3D networks on chip. / Kuroda, Tadahiro.

2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011. 2011. p. 238-241 6081644.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2011, ThruChip interface (TCI) for 3D networks on chip. in 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011., 6081644, pp. 238-241, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, 11/10/3. https://doi.org/10.1109/VLSISoC.2011.6081644
Kuroda T. ThruChip interface (TCI) for 3D networks on chip. In 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011. 2011. p. 238-241. 6081644 https://doi.org/10.1109/VLSISoC.2011.6081644
Kuroda, Tadahiro. / ThruChip interface (TCI) for 3D networks on chip. 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011. 2011. pp. 238-241
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