Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers

Jiwang Yan, Hirokazu Takahashi, Jun'ichi Tamaki, Xiaohui Gai, Tsunemoto Kuriyagawa

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Nanoindentation tests were performed on a ductile-machined silicon wafer with a Berkovich diamond indenter, and the resulting indents were examined with a transmission electron microscope. It was found that the machining-induced subsurface amorphous layer undergoes significant plastic flow, and the microstructure of the indent depends on the indentation load. At a small load (∼20 mN), most of the indented region remains to be amorphous with minor crystalline nuclei; while under a large load (∼50 mN), the amorphous phase undergoes intensive recrystallization. The understanding and utilization of this phenomenon might be useful for improving the microscopic surface properties of silicon parts produced by a ductile machining process.

Original languageEnglish
Article number211901
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number21
Publication statusPublished - 2005 Nov 25
Externally publishedYes


ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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