Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers

Jiwang Yan, Hirokazu Takahashi, Jun'ichi Tamaki, Xiaohui Gai, Tsunemoto Kuriyagawa

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

Nanoindentation tests were performed on a ductile-machined silicon wafer with a Berkovich diamond indenter, and the resulting indents were examined with a transmission electron microscope. It was found that the machining-induced subsurface amorphous layer undergoes significant plastic flow, and the microstructure of the indent depends on the indentation load. At a small load (∼20 mN), most of the indented region remains to be amorphous with minor crystalline nuclei; while under a large load (∼50 mN), the amorphous phase undergoes intensive recrystallization. The understanding and utilization of this phenomenon might be useful for improving the microscopic surface properties of silicon parts produced by a ductile machining process.

Original languageEnglish
Article number211901
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume87
Issue number21
DOIs
Publication statusPublished - 2005
Externally publishedYes

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nanoindentation
wafers
machining
silicon
electrons
plastic flow
indentation
surface properties
electron microscopes
diamonds
microstructure
nuclei

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers. / Yan, Jiwang; Takahashi, Hirokazu; Tamaki, Jun'ichi; Gai, Xiaohui; Kuriyagawa, Tsunemoto.

In: Applied Physics Letters, Vol. 87, No. 21, 211901, 2005, p. 1-3.

Research output: Contribution to journalArticle

Yan, Jiwang ; Takahashi, Hirokazu ; Tamaki, Jun'ichi ; Gai, Xiaohui ; Kuriyagawa, Tsunemoto. / Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers. In: Applied Physics Letters. 2005 ; Vol. 87, No. 21. pp. 1-3.
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