TY - JOUR
T1 - Two-dimensional MEMS scanner for dual-axes confocal microscopy
AU - Ra, Hyejun
AU - Piyawattanametha, Wibool
AU - Taguchi, Yoshihiro
AU - Lee, Daesung
AU - Mandella, Michael J.
AU - Solgaard, Olav
N1 - Funding Information:
Manuscript received October 6, 2006; revised November 23, 2006. This work was supported by the National Institutes of Health under Grant U54 CA105296. Subject Editor S. Merlo.
PY - 2007/8
Y1 - 2007/8
N2 - In this paper, we present a novel 2-D microelectromechanical systems (MEMS) scanner that enables dual-axes confocal microscopy. Dual-axes confocal microscopy provides high resolution and long working distance, while also being well suited for miniaturization and integration into endoscopes for in vivo imaging. The gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer (a silicon wafer bonded on a SOI wafer) and is actuated by self-aligned vertical electrostatic combdrives. Maximum optical deflections of ±4.8 ° and ±5.5 ° are achieved in static mode for the outer and inner axes, respectively. Torsional resonant frequencies are at 500 Hz and 2.9 kHz for the outer and inner axes, respectively. The imaging capability of the MEMS scanner is successfully demonstrated in a breadboard setup. Reflectance images with a field of view of 344 μm × 417 μm are achieved at 8 frames/s. The transverse resolutions are 3.94 and 6.68 μm for the horizontal and vertical dimensions, respectively.
AB - In this paper, we present a novel 2-D microelectromechanical systems (MEMS) scanner that enables dual-axes confocal microscopy. Dual-axes confocal microscopy provides high resolution and long working distance, while also being well suited for miniaturization and integration into endoscopes for in vivo imaging. The gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer (a silicon wafer bonded on a SOI wafer) and is actuated by self-aligned vertical electrostatic combdrives. Maximum optical deflections of ±4.8 ° and ±5.5 ° are achieved in static mode for the outer and inner axes, respectively. Torsional resonant frequencies are at 500 Hz and 2.9 kHz for the outer and inner axes, respectively. The imaging capability of the MEMS scanner is successfully demonstrated in a breadboard setup. Reflectance images with a field of view of 344 μm × 417 μm are achieved at 8 frames/s. The transverse resolutions are 3.94 and 6.68 μm for the horizontal and vertical dimensions, respectively.
KW - 2-D microelectromechanical systems (MEMS) scanner
KW - Dual-axes confocal microscopy
KW - Electrostatic actuation
KW - Micromirror
KW - Self-alignment
KW - Vertical comb actuators
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U2 - 10.1109/JMEMS.2007.892900
DO - 10.1109/JMEMS.2007.892900
M3 - Article
AN - SCOPUS:34548020544
SN - 1057-7157
VL - 16
SP - 969
EP - 976
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 4
ER -