Ultraprecision cutting of photoresist/gold composite microstructures

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Ultraprecision cutting tests were performed on a photoresist/gold bump composite and cutting characteristics were investigated by examining the surface topography, chip formation, cutting force, and temperature. The cutting mechanisms depended significantly on the cutting speed, undeformed chip thickness, and tool geometry. At a high cutting speed, photoresist softening occurred, leading to chip adhesion on tool faces and burr formation on gold bumps. Two kinds of microfractures were identified in the photoresist cutting, and critical cutting conditions for each were obtained. The findings in this study provide process criteria for ultraprecise planarization of LSI substrates for three-dimensional chip implementing technology.

Original languageEnglish
Pages (from-to)133-136
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume60
Issue number1
DOIs
Publication statusPublished - 2011
Externally publishedYes

Fingerprint

Photoresists
Gold
Microstructure
Composite materials
Surface topography
Adhesion
Geometry
Substrates

Keywords

  • Cutting
  • Microstructure
  • Ultraprecision

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

Ultraprecision cutting of photoresist/gold composite microstructures. / Yan, Jiwang.

In: CIRP Annals - Manufacturing Technology, Vol. 60, No. 1, 2011, p. 133-136.

Research output: Contribution to journalArticle

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