Ultrasonic-vibration-assisted micromachining of sapphire

Hiroki Wakabayashi, Ryo Koike, Yasuhiro Kakinuma, Tojiro Aoyama, Hiroyuki Shimada, Seiji Hamada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.

Original languageEnglish
Title of host publicationAdvances in Abrasive Technology XIX
EditorsPeter Krajnik, Peter Krajnik, Amir Rashid, Hideki Aoyama, Xipeng Xu, Jun Wang
PublisherTrans Tech Publications Ltd
Pages247-252
Number of pages6
ISBN (Print)9783035710342
DOIs
Publication statusPublished - 2016 Jan 1
Event19th International Symposium on Advances in Abrasive Technology, ISAAT 2016 - Stockholm, Sweden
Duration: 2016 Oct 22016 Oct 5

Publication series

NameMaterials Science Forum
Volume874
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other19th International Symposium on Advances in Abrasive Technology, ISAAT 2016
CountrySweden
CityStockholm
Period16/10/216/10/5

Keywords

  • Micromachining
  • Sapphire
  • Ultrasonic vibration

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Wakabayashi, H., Koike, R., Kakinuma, Y., Aoyama, T., Shimada, H., & Hamada, S. (2016). Ultrasonic-vibration-assisted micromachining of sapphire. In P. Krajnik, P. Krajnik, A. Rashid, H. Aoyama, X. Xu, & J. Wang (Eds.), Advances in Abrasive Technology XIX (pp. 247-252). (Materials Science Forum; Vol. 874). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.874.247