Ultrasonic-vibration-assisted micromachining of sapphire

Hiroki Wakabayashi, Ryo Koike, Yasuhiro Kakinuma, Tojiro Aoyama, Hiroyuki Shimada, Seiji Hamada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.

Original languageEnglish
Title of host publicationAdvances in Abrasive Technology XIX
PublisherTrans Tech Publications Ltd
Pages247-252
Number of pages6
Volume874
ISBN (Print)9783035710342
DOIs
Publication statusPublished - 2016
Event19th International Symposium on Advances in Abrasive Technology, ISAAT 2016 - Stockholm, Sweden
Duration: 2016 Oct 22016 Oct 5

Publication series

NameMaterials Science Forum
Volume874
ISSN (Print)02555476

Other

Other19th International Symposium on Advances in Abrasive Technology, ISAAT 2016
CountrySweden
CityStockholm
Period16/10/216/10/5

Fingerprint

Aluminum Oxide
Micromachining
micromachining
Sapphire
chipping
Vibrations (mechanical)
sapphire
ultrasonics
Ultrasonics
drilling
vibration
Drilling
Wear of materials
Smartphones
corrosion
hardness
Hardness
engineering
Corrosion
Glass

Keywords

  • Micromachining
  • Sapphire
  • Ultrasonic vibration

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Wakabayashi, H., Koike, R., Kakinuma, Y., Aoyama, T., Shimada, H., & Hamada, S. (2016). Ultrasonic-vibration-assisted micromachining of sapphire. In Advances in Abrasive Technology XIX (Vol. 874, pp. 247-252). (Materials Science Forum; Vol. 874). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.874.247

Ultrasonic-vibration-assisted micromachining of sapphire. / Wakabayashi, Hiroki; Koike, Ryo; Kakinuma, Yasuhiro; Aoyama, Tojiro; Shimada, Hiroyuki; Hamada, Seiji.

Advances in Abrasive Technology XIX. Vol. 874 Trans Tech Publications Ltd, 2016. p. 247-252 (Materials Science Forum; Vol. 874).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wakabayashi, H, Koike, R, Kakinuma, Y, Aoyama, T, Shimada, H & Hamada, S 2016, Ultrasonic-vibration-assisted micromachining of sapphire. in Advances in Abrasive Technology XIX. vol. 874, Materials Science Forum, vol. 874, Trans Tech Publications Ltd, pp. 247-252, 19th International Symposium on Advances in Abrasive Technology, ISAAT 2016, Stockholm, Sweden, 16/10/2. https://doi.org/10.4028/www.scientific.net/MSF.874.247
Wakabayashi H, Koike R, Kakinuma Y, Aoyama T, Shimada H, Hamada S. Ultrasonic-vibration-assisted micromachining of sapphire. In Advances in Abrasive Technology XIX. Vol. 874. Trans Tech Publications Ltd. 2016. p. 247-252. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.874.247
Wakabayashi, Hiroki ; Koike, Ryo ; Kakinuma, Yasuhiro ; Aoyama, Tojiro ; Shimada, Hiroyuki ; Hamada, Seiji. / Ultrasonic-vibration-assisted micromachining of sapphire. Advances in Abrasive Technology XIX. Vol. 874 Trans Tech Publications Ltd, 2016. pp. 247-252 (Materials Science Forum).
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