Ultrasonic-vibration-assisted micromachining of sapphire

Hiroki Wakabayashi; Ryo Koike; Yasuhiro Kakinuma; Tojiro Aoyama; Hiroyuki Shimada; Seiji Hamada

doi:10.4028/www.scientific.net/MSF.874.247

Ultrasonic-vibration-assisted micromachining of sapphire

Hiroki Wakabayashi, Ryo Koike, Yasuhiro Kakinuma, Tojiro Aoyama, Hiroyuki Shimada, Seiji Hamada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Sapphire is an attractive engineering material for the cover glass of smartphones and wristwatches because of its high hardness and resistance to corrosion, wear, and heat. However, the high rate of tool wear and brittle chippings around the holes are serious problems associated with drilling sapphire. To enhance the accuracy and efficiency of the drilling process on sapphire, this paper presents a novel tool-path strategy using helical milling along with various tool path patterns. Experimental results show that the proposed method successfully reduces brittle chippings around the holes.

Original language	English
Title of host publication	Advances in Abrasive Technology XIX
Editors	Peter Krajnik, Peter Krajnik, Amir Rashid, Hideki Aoyama, Xipeng Xu, Jun Wang
Publisher	Trans Tech Publications Ltd
Pages	247-252
Number of pages	6
ISBN (Print)	9783035710342
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.874.247
Publication status	Published - 2016
Event	19th International Symposium on Advances in Abrasive Technology, ISAAT 2016 - Stockholm, Sweden Duration: 2016 Oct 2 → 2016 Oct 5

Publication series

Name	Materials Science Forum
Volume	874
ISSN (Print)	0255-5476
ISSN (Electronic)	1662-9752

Other

Other	19th International Symposium on Advances in Abrasive Technology, ISAAT 2016
Country/Territory	Sweden
City	Stockholm
Period	16/10/2 → 16/10/5

Keywords

Micromachining
Sapphire
Ultrasonic vibration

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.4028/www.scientific.net/MSF.874.247

Cite this

Wakabayashi, H., Koike, R., Kakinuma, Y., Aoyama, T., Shimada, H., & Hamada, S. (2016). Ultrasonic-vibration-assisted micromachining of sapphire. In P. Krajnik, P. Krajnik, A. Rashid, H. Aoyama, X. Xu, & J. Wang (Eds.), Advances in Abrasive Technology XIX (pp. 247-252). (Materials Science Forum; Vol. 874). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.874.247

Ultrasonic-vibration-assisted micromachining of sapphire. / Wakabayashi, Hiroki; Koike, Ryo ; Kakinuma, Yasuhiro et al.
Advances in Abrasive Technology XIX. ed. / Peter Krajnik; Peter Krajnik; Amir Rashid; Hideki Aoyama; Xipeng Xu; Jun Wang. Trans Tech Publications Ltd, 2016. p. 247-252 (Materials Science Forum; Vol. 874).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wakabayashi, H, Koike, R , Kakinuma, Y, Aoyama, T, Shimada, H & Hamada, S 2016, Ultrasonic-vibration-assisted micromachining of sapphire. in P Krajnik, P Krajnik, A Rashid, H Aoyama, X Xu & J Wang (eds), Advances in Abrasive Technology XIX. Materials Science Forum, vol. 874, Trans Tech Publications Ltd, pp. 247-252, 19th International Symposium on Advances in Abrasive Technology, ISAAT 2016, Stockholm, Sweden, 16/10/2. https://doi.org/10.4028/www.scientific.net/MSF.874.247

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Ultrasonic-vibration-assisted micromachining of sapphire

Abstract

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Keywords

ASJC Scopus subject areas

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