Use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on a silicon substrate

S. Matsuo, K. Tateno, T. Nakahara, H. Tsuda, T. Kurokawa

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

The use of polyimide bonding for hybrid integration of a vertical cavity surface emitting laser on an Si substrate was demonstrated. The threshold current was 3.1mA and the maximum output power was 2.45mW for a 15μm diameter mesa. This technology is suitable for integrating photonic devices with an Si-LSI circuit.

Original languageEnglish
Pages (from-to)1148-1149
Number of pages2
JournalElectronics Letters
Volume33
Issue number13
DOIs
Publication statusPublished - 1997 Jun 19
Externally publishedYes

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Keywords

  • Integrated optoelectronics
  • Vertical cavity surface emitting lasers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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