Abstract
A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 195-201 |
| Number of pages | 7 |
| ISBN (Electronic) | 9781509026555 |
| DOIs | |
| Publication status | Published - 2017 Jan 13 |
| Event | 4th International Symposium on Computing and Networking, CANDAR 2016 - Hiroshima, Japan Duration: 2016 Nov 22 → 2016 Nov 25 |
Other
| Other | 4th International Symposium on Computing and Networking, CANDAR 2016 |
|---|---|
| Country | Japan |
| City | Hiroshima |
| Period | 16/11/22 → 16/11/25 |
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ASJC Scopus subject areas
- Computer Science Applications
- Hardware and Architecture
- Signal Processing
- Computer Networks and Communications
Cite this
Vertical packet switching elevator network using inductive coupling ThruChip interface. / Nomura, Akio; Matsutani, Hiroki; Kuroda, Tadahiro; Kadomoto, Junichiro; Matsushita, Yusuke; Amano, Hideharu.
Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 195-201 7818613.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Vertical packet switching elevator network using inductive coupling ThruChip interface
AU - Nomura, Akio
AU - Matsutani, Hiroki
AU - Kuroda, Tadahiro
AU - Kadomoto, Junichiro
AU - Matsushita, Yusuke
AU - Amano, Hideharu
PY - 2017/1/13
Y1 - 2017/1/13
N2 - A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.
AB - A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.
UR - http://www.scopus.com/inward/record.url?scp=85015221497&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85015221497&partnerID=8YFLogxK
U2 - 10.1109/CANDAR.2016.73
DO - 10.1109/CANDAR.2016.73
M3 - Conference contribution
AN - SCOPUS:85015221497
SP - 195
EP - 201
BT - Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016
PB - Institute of Electrical and Electronics Engineers Inc.
ER -