Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura; Hiroki Matsutani; Tadahiro Kuroda; Junichiro Kadomoto; Yusuke Matsushita; Hideharu Amano

doi:10.1109/CANDAR.2016.73

Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura, Hiroki Matsutani, Tadahiro Kuroda, Junichiro Kadomoto, Yusuke Matsushita, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

Original language	English
Title of host publication	Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	195-201
Number of pages	7
ISBN (Electronic)	9781509026555
DOIs	https://doi.org/10.1109/CANDAR.2016.73
Publication status	Published - 2017 Jan 13
Event	4th International Symposium on Computing and Networking, CANDAR 2016 - Hiroshima, Japan Duration: 2016 Nov 22 → 2016 Nov 25

Other

Other	4th International Symposium on Computing and Networking, CANDAR 2016
Country	Japan
City	Hiroshima
Period	16/11/22 → 16/11/25

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ASJC Scopus subject areas

Computer Science Applications
Hardware and Architecture
Signal Processing
Computer Networks and Communications

Cite this

Nomura, A., Matsutani, H., Kuroda, T., Kadomoto, J., Matsushita, Y., & Amano, H. (2017). Vertical packet switching elevator network using inductive coupling ThruChip interface. In Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016 (pp. 195-201). [7818613] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CANDAR.2016.73

Vertical packet switching elevator network using inductive coupling ThruChip interface. / Nomura, Akio; Matsutani, Hiroki ; Kuroda, Tadahiro; Kadomoto, Junichiro; Matsushita, Yusuke; Amano, Hideharu.

Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 195-201 7818613.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nomura, A, Matsutani, H , Kuroda, T, Kadomoto, J, Matsushita, Y & Amano, H 2017, Vertical packet switching elevator network using inductive coupling ThruChip interface. in Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016., 7818613, Institute of Electrical and Electronics Engineers Inc., pp. 195-201, 4th International Symposium on Computing and Networking, CANDAR 2016, Hiroshima, Japan, 16/11/22. https://doi.org/10.1109/CANDAR.2016.73

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Access to Document

10.1109/CANDAR.2016.73