Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura, Hiroki Matsutani, Tadahiro Kuroda, Junichiro Kadomoto, Yusuke Matsushita, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

Original languageEnglish
Title of host publicationProceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages195-201
Number of pages7
ISBN (Electronic)9781509026555
DOIs
Publication statusPublished - 2017 Jan 13
Event4th International Symposium on Computing and Networking, CANDAR 2016 - Hiroshima, Japan
Duration: 2016 Nov 222016 Nov 25

Other

Other4th International Symposium on Computing and Networking, CANDAR 2016
CountryJapan
CityHiroshima
Period16/11/2216/11/25

ASJC Scopus subject areas

  • Computer Science Applications
  • Hardware and Architecture
  • Signal Processing
  • Computer Networks and Communications

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  • Cite this

    Nomura, A., Matsutani, H., Kuroda, T., Kadomoto, J., Matsushita, Y., & Amano, H. (2017). Vertical packet switching elevator network using inductive coupling ThruChip interface. In Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016 (pp. 195-201). [7818613] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CANDAR.2016.73