Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura; Hiroki Matsutani; Tadahiro Kuroda; Junichiro Kadomoto; Yusuke Matsushita; Hideharu Amano

doi:10.1109/CANDAR.2016.73

Vertical packet switching elevator network using inductive coupling ThruChip interface

Akio Nomura, Hiroki Matsutani, Tadahiro Kuroda, Junichiro Kadomoto, Yusuke Matsushita, Hideharu Amano

Department of Information and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

Original language	English
Title of host publication	Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	195-201
Number of pages	7
ISBN (Electronic)	9781509026555
DOIs	https://doi.org/10.1109/CANDAR.2016.73
Publication status	Published - 2017 Jan 13
Event	4th International Symposium on Computing and Networking, CANDAR 2016 - Hiroshima, Japan Duration: 2016 Nov 22 → 2016 Nov 25

Publication series

Name	Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016

Other

Other	4th International Symposium on Computing and Networking, CANDAR 2016
Country/Territory	Japan
City	Hiroshima
Period	16/11/22 → 16/11/25

ASJC Scopus subject areas

Computer Science Applications
Hardware and Architecture
Signal Processing
Computer Networks and Communications

Access to Document

10.1109/CANDAR.2016.73

Cite this

Nomura, A., Matsutani, H., Kuroda, T., Kadomoto, J., Matsushita, Y., & Amano, H. (2017). Vertical packet switching elevator network using inductive coupling ThruChip interface. In Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016 (pp. 195-201). [7818613] (Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CANDAR.2016.73

Vertical packet switching elevator network using inductive coupling ThruChip interface. / Nomura, Akio; Matsutani, Hiroki; Kuroda, Tadahiro et al.

Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 195-201 7818613 (Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nomura, A, Matsutani, H, Kuroda, T, Kadomoto, J, Matsushita, Y & Amano, H 2017, Vertical packet switching elevator network using inductive coupling ThruChip interface. in Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016., 7818613, Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016, Institute of Electrical and Electronics Engineers Inc., pp. 195-201, 4th International Symposium on Computing and Networking, CANDAR 2016, Hiroshima, Japan, 16/11/22. https://doi.org/10.1109/CANDAR.2016.73

Nomura A, Matsutani H, Kuroda T, Kadomoto J, Matsushita Y, Amano H. Vertical packet switching elevator network using inductive coupling ThruChip interface. In Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016. Institute of Electrical and Electronics Engineers Inc. 2017. p. 195-201. 7818613. (Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016). doi: 10.1109/CANDAR.2016.73

Nomura, Akio ; Matsutani, Hiroki ; Kuroda, Tadahiro et al. / Vertical packet switching elevator network using inductive coupling ThruChip interface. Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 195-201 (Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016).

@inproceedings{68ad4121cb454bb7af0c717e4f7a8875,

title = "Vertical packet switching elevator network using inductive coupling ThruChip interface",

abstract = "A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.",

author = "Akio Nomura and Hiroki Matsutani and Tadahiro Kuroda and Junichiro Kadomoto and Yusuke Matsushita and Hideharu Amano",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 4th International Symposium on Computing and Networking, CANDAR 2016 ; Conference date: 22-11-2016 Through 25-11-2016",

year = "2017",

month = jan,

day = "13",

doi = "10.1109/CANDAR.2016.73",

language = "English",

series = "Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "195--201",

booktitle = "Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016",

}

TY - GEN

T1 - Vertical packet switching elevator network using inductive coupling ThruChip interface

AU - Nomura, Akio

AU - Matsutani, Hiroki

AU - Kuroda, Tadahiro

AU - Kadomoto, Junichiro

AU - Matsushita, Yusuke

AU - Amano, Hideharu

PY - 2017/1/13

Y1 - 2017/1/13

N2 - A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

AB - A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.

UR - http://www.scopus.com/inward/record.url?scp=85015221497&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85015221497&partnerID=8YFLogxK

U2 - 10.1109/CANDAR.2016.73

DO - 10.1109/CANDAR.2016.73

M3 - Conference contribution

AN - SCOPUS:85015221497

T3 - Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016

SP - 195

EP - 201

BT - Proceedings - 2016 4th International Symposium on Computing and Networking, CANDAR 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 4th International Symposium on Computing and Networking, CANDAR 2016

Y2 - 22 November 2016 through 25 November 2016

ER -

Vertical packet switching elevator network using inductive coupling ThruChip interface

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