WDM Optical Interconnection Modules for Tb/s-Class Electro-Optical Switching System

Nobuaki Matsuura, Takaharu Ohyama, Eiji Oki, Kimihiro Yamakoshi, Yuji Akahori, Naoaki Yamanaka

Research output: Contribution to journalArticle

Abstract

We have demonstrated optical WDM (wavelength division multiplexing) packet-by-packet interconnection modules for a 5-Tb/s electro-optical switching system. Interconnection is performed by electrical control of the data flow and optical wavelength-routed switching, for which we fabricated WDM transmitter and receiver modules that have 2. 5-Gb/s, 8-wavelength optical channels. A channel spacing of 500 GHz provides the wavelength precision needed to meet the optical power budget design. Optical WDM interfaces are assembled very compactly using planar lightwave circuit hybrid integration technology. The basic operation of the modules was successfully confirmed.

Original languageEnglish
Pages (from-to)168-172
Number of pages5
Journaljournal of the japan institute of electronics packaging
Volume6
Issue number2
DOIs
Publication statusPublished - 2004
Externally publishedYes

Fingerprint

Optical interconnects
Switching systems
Wavelength division multiplexing
Wavelength
Transmitters
Networks (circuits)

Keywords

  • Electro-Optical Switching
  • Optical Interconnection
  • PLC Hybrid Integration
  • WDM

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

WDM Optical Interconnection Modules for Tb/s-Class Electro-Optical Switching System. / Matsuura, Nobuaki; Ohyama, Takaharu; Oki, Eiji; Yamakoshi, Kimihiro; Akahori, Yuji; Yamanaka, Naoaki.

In: journal of the japan institute of electronics packaging, Vol. 6, No. 2, 2004, p. 168-172.

Research output: Contribution to journalArticle

Matsuura, Nobuaki ; Ohyama, Takaharu ; Oki, Eiji ; Yamakoshi, Kimihiro ; Akahori, Yuji ; Yamanaka, Naoaki. / WDM Optical Interconnection Modules for Tb/s-Class Electro-Optical Switching System. In: journal of the japan institute of electronics packaging. 2004 ; Vol. 6, No. 2. pp. 168-172.
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