Wear mechanism of diamond tools in ductile machining of reaction-bonded silicon carbide

Zhiyu Zhang, Jiwang Yan, Tsunemoto Kuriyagawa

Research output: Contribution to conferencePaper

Abstract

Wear mechanisms of single-crystal diamond tools in ductile machining of reaction-bonded silicon carbide (RB-SiC) were investigated. It was found that tool wear could be generally classified into two types. One is microchippings on the cutting edge, which were induced by micro impacts between the cutting edge and SiC grains. The other is two kinds of gradual wear patterns on flank face caused by different mechanisms: non-periodical scratches caused by scratching effects of the SiC grains, and periodical grooves caused by transcribing effect of tool feed marks on the machined surface. A tool-swinging cutting method was proposed to improve the service life of diamond tools.

Original languageEnglish
Publication statusPublished - 2009 Dec 1
Event5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009 - Osaka, Japan
Duration: 2009 Dec 22009 Dec 4

Other

Other5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009
CountryJapan
CityOsaka
Period09/12/209/12/4

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Keywords

  • Diamond tool wear
  • Ductile machining
  • Microplasticity
  • Silicon carbide

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Zhang, Z., Yan, J., & Kuriyagawa, T. (2009). Wear mechanism of diamond tools in ductile machining of reaction-bonded silicon carbide. Paper presented at 5th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2009, Osaka, Japan.