Wearable thermal interface for sharing palm heat conduction

Yukiko Osawa, Seiichiro Katsura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Developing a thermal interface to share a thermal sensation between remote locations can lead to significant progress in the field of haptics. The research focuses on a technique of rendering thermal sensation that is an essential element of the haptics for touching human and machines each other. The thermal technique is required in case of offering a sense of security and sharing a precise hand with thermal sensations between remote places such as nursing care and rehabilitation robot. This paper proposed a method to control heat conduction on a palm by setting virtual thermal conductance between two fingers of the glove. Two thermal gloves are used as a master/slave systems, and the virtual thermal conductance can change heat conduction on the palm. The proposed interface and its control algorithm can be used to share a spatial thermal sensation on a palm. The experimental results indicate the validity of the proposed method. The interface and its control system are expected to connect people in remote locations, and the developed system can potentially be used in medical and multimedia applications.

Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationIECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3310-3315
Number of pages6
ISBN (Electronic)9781509066841
DOIs
Publication statusPublished - 2018 Dec 26
Event44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018 - Washington, United States
Duration: 2018 Oct 202018 Oct 23

Publication series

NameProceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

Conference

Conference44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018
CountryUnited States
CityWashington
Period18/10/2018/10/23

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Control and Optimization

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  • Cite this

    Osawa, Y., & Katsura, S. (2018). Wearable thermal interface for sharing palm heat conduction. In Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society (pp. 3310-3315). [8591352] (Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IECON.2018.8591352