Wideband Inductive-coupling Interface for High-performance Portable System

Hiroki Ishikuro, Noriyuki Miura, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    16 Citations (Scopus)

    Abstract

    This paper presents a wideband, low power, and low cost pulse-based inductive-coupling interface for wireless data transfer in high performance portable devices. General aspects of wireless links are discussed to understand the position of the inductive-coupling technique. Two applications of a pulse-based inductive-coupling interface are introduced One is a 0.14pJ/b inter-chip link for System-in-a-Package. The other is a detachable wireless interface for chip monitoring through LSI package. Circuit design techniques for a power reduction and an extension of communication range are presented.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE 2007 Custom Integrated Circuits Conference, CICC 2007
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages13-20
    Number of pages8
    ISBN (Electronic)1424407869, 9781424407866
    DOIs
    Publication statusPublished - 2007 Jan 1
    Event29th Annual IEEE Custom Integrated Circuits Conference, CICC 2007 - San Jose, United States
    Duration: 2007 Sep 162007 Sep 19

    Publication series

    NameProceedings of the IEEE 2007 Custom Integrated Circuits Conference, CICC 2007

    Other

    Other29th Annual IEEE Custom Integrated Circuits Conference, CICC 2007
    CountryUnited States
    CitySan Jose
    Period07/9/1607/9/19

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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  • Cite this

    Ishikuro, H., Miura, N., & Kuroda, T. (2007). Wideband Inductive-coupling Interface for High-performance Portable System. In Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, CICC 2007 (pp. 13-20). [4405672] (Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, CICC 2007). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CICC.2007.4405672