Abstract
Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
| Original language | English |
|---|---|
| Pages (from-to) | 30-33 |
| Number of pages | 4 |
| Journal | Sensors and Actuators, B: Chemical |
| Volume | 49 |
| Issue number | 1-2 |
| Publication status | Published - 1998 Jun 25 |
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Keywords
- Electropolymerization
- Micro-needle
- Polypyrrole
- Wire bonding
ASJC Scopus subject areas
- Analytical Chemistry
- Electrochemistry
- Electrical and Electronic Engineering
Cite this
Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle. / Shiratori, Seimei; Mori, Seiji; Ikezaki, Kazuo.
In: Sensors and Actuators, B: Chemical, Vol. 49, No. 1-2, 25.06.1998, p. 30-33.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle
AU - Shiratori, Seimei
AU - Mori, Seiji
AU - Ikezaki, Kazuo
PY - 1998/6/25
Y1 - 1998/6/25
N2 - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
AB - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.
KW - Electropolymerization
KW - Micro-needle
KW - Polypyrrole
KW - Wire bonding
UR - http://www.scopus.com/inward/record.url?scp=0032089803&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0032089803&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0032089803
VL - 49
SP - 30
EP - 33
JO - Sensors and Actuators, B: Chemical
JF - Sensors and Actuators, B: Chemical
SN - 0925-4005
IS - 1-2
ER -