Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

Seimei Sha Shiratori, Seiji Mori, Kazuo Ikezaki

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

Original languageEnglish
Pages (from-to)30-33
Number of pages4
JournalSensors and Actuators, B: Chemical
Volume49
Issue number1-2
DOIs
Publication statusPublished - 1998 Jun 25

Keywords

  • Electropolymerization
  • Micro-needle
  • Polypyrrole
  • Wire bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry

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