Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle

Seimei Sha Shiratori; Seiji Mori; Kazuo Ikezaki

Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle

Seimei Sha Shiratori, Seiji Mori, Kazuo Ikezaki

Department of Applied Physics and Physico-Informatics

Research output: Contribution to conference › Paper › peer-review

Abstract

Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

Original language	English
Pages	269-272
Number of pages	4
Publication status	Published - 1997 Jan 1
Event	Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) - Chicago, IL, USA Duration: 1997 Jun 16 → 1997 Jun 19

Other

Other	Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2)
City	Chicago, IL, USA
Period	97/6/16 → 97/6/19

ASJC Scopus subject areas

Engineering(all)

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Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle. / Shiratori, Seimei Sha; Mori, Seiji; Ikezaki, Kazuo.
1997. 269-272 Paper presented at Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2), Chicago, IL, USA.

Research output: Contribution to conference › Paper › peer-review

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abstract = "Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.",

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AU - Shiratori, Seimei Sha

AU - Mori, Seiji

AU - Ikezaki, Kazuo

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Y1 - 1997/1/1

N2 - Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

AB - Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

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ER -

Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle

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ASJC Scopus subject areas

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