Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle

Seimei Sha Shiratori, Seiji Mori, Kazuo Ikezaki

Research output: Contribution to conferencePaper

Abstract

Electrically conducting wire of 10 - 200 μm width was formed freely over the electrically insulating substrate by `electropolymerization of conducting polymer using Scanning Microneedle'. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

Original languageEnglish
Pages269-272
Number of pages4
Publication statusPublished - 1997 Jan 1
EventProceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2) - Chicago, IL, USA
Duration: 1997 Jun 161997 Jun 19

Other

OtherProceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2)
CityChicago, IL, USA
Period97/6/1697/6/19

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Shiratori, S. S., Mori, S., & Ikezaki, K. (1997). Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle. 269-272. Paper presented at Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2), Chicago, IL, USA, .