Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)
Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
DOIs
Publication statusPublished - 2009
Event2009 IEEE International Solid-State Circuits Conference ISSCC 2009 - San Francisco, CA, United States
Duration: 2009 Feb 82009 Feb 12

Other

Other2009 IEEE International Solid-State Circuits Conference ISSCC 2009
CountryUnited States
CitySan Francisco, CA
Period09/2/809/2/12

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Testing
Electric potential

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yoshida, Y., Nose, K., Nakagawa, Y., Noguchi, K., Morita, Y., Tago, M., ... Mizuno, M. (2009). Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference [4977512] https://doi.org/10.1109/ISSCC.2009.4977512

Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. / Yoshida, Yoichi; Nose, Koichi; Nakagawa, Yoshihiro; Noguchi, Koichiro; Morita, Yasuhiro; Tago, Masamoto; Kuroda, Tadahiro; Mizuno, Masayuki.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009. 4977512.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yoshida, Y, Nose, K, Nakagawa, Y, Noguchi, K, Morita, Y, Tago, M, Kuroda, T & Mizuno, M 2009, Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference., 4977512, 2009 IEEE International Solid-State Circuits Conference ISSCC 2009, San Francisco, CA, United States, 09/2/8. https://doi.org/10.1109/ISSCC.2009.4977512
Yoshida Y, Nose K, Nakagawa Y, Noguchi K, Morita Y, Tago M et al. Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009. 4977512 https://doi.org/10.1109/ISSCC.2009.4977512
Yoshida, Yoichi ; Nose, Koichi ; Nakagawa, Yoshihiro ; Noguchi, Koichiro ; Morita, Yasuhiro ; Tago, Masamoto ; Kuroda, Tadahiro ; Mizuno, Masayuki. / Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009.
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