Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    17 Citations (Scopus)
    Original languageEnglish
    Title of host publication2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages470-472
    Number of pages3
    ISBN (Print)1424434580, 9781424434589
    DOIs
    Publication statusPublished - 2009
    Event2009 IEEE International Solid-State Circuits Conference ISSCC 2009 - San Francisco, CA, United States
    Duration: 2009 Feb 82009 Feb 12

    Publication series

    NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    ISSN (Print)0193-6530

    Other

    Other2009 IEEE International Solid-State Circuits Conference ISSCC 2009
    CountryUnited States
    CitySan Francisco, CA
    Period09/2/809/2/12

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

    Cite this

    Yoshida, Y., Nose, K., Nakagawa, Y., Noguchi, K., Morita, Y., Tago, M., Kuroda, T., & Mizuno, M. (2009). Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009 (pp. 470-472). [4977512] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2009.4977512