Wireless proximity communications for 3D system integration

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Capacitive and inductive coupling I/Os are emerging non-contact parallel links for chips that are stacked in a package. The capacitive coupling utilizes a pair of electrodes that are formed by top layer of IC interconnections. The inductive coupling uses coils, just like a transformer, that are rolled by the IC interconnections. They are implemented by digital circuits in a standard CMOS. No new wafer process or mechanical process is required, and hence inexpensive. Since there is no pad exposed for contact, ESD protection structure can be removed. Chips under difference supply voltages can be directly connected, since they provide with an AC-coupling interface. This paper presents fundamental differences between the inductive coupling and the capacitive coupling. Secondly, advantages of the inductive coupling over Through-Silicon-Vias and micro-bumps are discussed. Circuit techniques to raise aggregated data rate to 1Tb/s, and lower energy dissipation to 0.14pJ/b are presented. Future challenges and opportunities such as a 3D scaling scenario are described.

Original languageEnglish
Title of host publicationRFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology
Pages21-25
Number of pages5
DOIs
Publication statusPublished - 2007
EventIEEE International Workshop on Radio-Frequency Integration Technology, RFIT 2007 - Singapore, Singapore
Duration: 2007 Dec 92007 Dec 11

Other

OtherIEEE International Workshop on Radio-Frequency Integration Technology, RFIT 2007
CountrySingapore
CitySingapore
Period07/12/907/12/11

Fingerprint

interconnection
communications
Communication
Digital circuits
scaling
Energy dissipation
contact
supply
scenario
energy
Silicon
Electrodes
Networks (circuits)
Electric potential
Integrated circuit interconnects

Keywords

  • Inductive coupling
  • Proximity communication
  • SiP

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Communication

Cite this

Kuroda, T. (2007). Wireless proximity communications for 3D system integration. In RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology (pp. 21-25). [4443910] https://doi.org/10.1109/RFIT.2007.4443910

Wireless proximity communications for 3D system integration. / Kuroda, Tadahiro.

RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology. 2007. p. 21-25 4443910.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2007, Wireless proximity communications for 3D system integration. in RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology., 4443910, pp. 21-25, IEEE International Workshop on Radio-Frequency Integration Technology, RFIT 2007, Singapore, Singapore, 07/12/9. https://doi.org/10.1109/RFIT.2007.4443910
Kuroda T. Wireless proximity communications for 3D system integration. In RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology. 2007. p. 21-25. 4443910 https://doi.org/10.1109/RFIT.2007.4443910
Kuroda, Tadahiro. / Wireless proximity communications for 3D system integration. RFIT 2007 - IEEE International Workshop on Radio-Frequency Integration Technology. 2007. pp. 21-25
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