TY - GEN
T1 - Y-branched multimode/single-mode polymer optical waveguides for low-loss WDM MUX device
T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019
AU - Ishigure, Takaaki
AU - Nakayama, Tomoki
AU - Nakazaki, Fukino
AU - Hama, Hiroki
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/5
Y1 - 2019/5
N2 - In this paper, we represent low-loss Y-branched multimode polymer optical waveguides with graded-index (GI) cores applicable to an optical coupler as a MUX device in coarse wavelength division multiplexing links. We apply the Mosquito method as well as the imprint method to form the Y-branched structures in polymers. We experimentally confirm that the insertion loss (including the coupling, propagation, bending, and multiplexing losses) in the multimode GI-core Y-branched waveguide is approximately 1-dB lower than the same Y-branched waveguide with step-index (SI) core. In addition, we also succeeded in fabricating Y-branched single-mode polymer waveguides applying the Mosquito method. In order to satisfy the single-mode condition, the core diameter needs to decrease to 10 mm and less.
AB - In this paper, we represent low-loss Y-branched multimode polymer optical waveguides with graded-index (GI) cores applicable to an optical coupler as a MUX device in coarse wavelength division multiplexing links. We apply the Mosquito method as well as the imprint method to form the Y-branched structures in polymers. We experimentally confirm that the insertion loss (including the coupling, propagation, bending, and multiplexing losses) in the multimode GI-core Y-branched waveguide is approximately 1-dB lower than the same Y-branched waveguide with step-index (SI) core. In addition, we also succeeded in fabricating Y-branched single-mode polymer waveguides applying the Mosquito method. In order to satisfy the single-mode condition, the core diameter needs to decrease to 10 mm and less.
KW - Coarse wavelength division multiplexing (CWDM)
KW - Polymer optical waveguide
KW - The Mosquito method
UR - http://www.scopus.com/inward/record.url?scp=85072297519&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85072297519&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2019.00089
DO - 10.1109/ECTC.2019.00089
M3 - Conference contribution
AN - SCOPUS:85072297519
T3 - Proceedings - Electronic Components and Technology Conference
SP - 550
EP - 555
BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 28 May 2019 through 31 May 2019
ER -