Morello, A.,
Tosi, G.,
Mohiyaddin, F. A.,
Schmitt, V.,
Mourik, V.,
Botzem, T.,
Laucht, A.,
Pla, J. J.,
Tenberg, S.,
Savytskyy, R.,
Madzik, M.,
Hudson, F.,
Dzurak, A. S.,
Itoh, K. M.,
Jakob, A. M.,
Johnson, B. C.,
McCallum, J. C. &
Jamieson, D. N.,
2019 1月 16,
2018 IEEE International Electron Devices Meeting, IEDM 2018. Institute of Electrical and Electronics Engineers Inc.,
p. 6.2.1-6.2.4 8614498. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2018-December).
研究成果: Conference contribution