• 744 引用
  • 12 h指数
20002020

年単位の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

研究成果

2020

A phase-field ductile fracture model with a variable regularization length parameter

Han, J., Nishi, S., Takada, K., Muramatsu, M., Omiya, M., Ogawa, K., Oide, K., Kobayashi, T., Murata, M., Moriguchi, S. & Terada, K., 2020, : : Transactions of the Japan Society for Computational Engineering and Science. 2020, p. 1-15 15 p., 20200005.

研究成果: Article

2019

Investigation on simplified equation for estimating J-integral of adhesive joint and its application to galvannealed steel plate+1

Ogawa, K., Maeda, R., Kobayashi, T., Yokoi, E., Furusawa, T., Takada, K. & Omiya, M., 2019 1 1, : : Materials Transactions. 60, 9, p. 1928-1935 8 p.

研究成果: Article

Modelling of intracranial behaviour on occiput impact in judo

Suzuki, R., Omiya, M., Hoshino, H., Kamitani, T. & Miyazaki, Y., 2019 1 1, : : Computer Methods in Biomechanics and Biomedical Engineering.

研究成果: Article

2018
1 引用 (Scopus)
1 引用 (Scopus)
2 引用 (Scopus)

Impact-induced fracture mechanisms of immiscible PC/ABS (50/50) blends

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2018 4 6, : : IOP Conference Series: Materials Science and Engineering. 334, 1, 012078.

研究成果: Conference article

1 引用 (Scopus)

Prediction of shear length in blanking process by numerical analysis

Sato, S. & Omiya, M., 2018 1 1, Technology of Plasticity. Wang, G-J., Fann, K-J., Hwang, Y-M. & Jiang, C-P. (版). Trans Tech Publications Ltd, p. 181-186 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

接着継手における j 積分簡易評価式の検討と ga 鋼板への適用

Ogawa, K., Maeda, R., Kobayashi, T., Yokoi, E., Furusawa, T., Takada, K. & Omiya, M., 2018 12 1, : : Zairyo/Journal of the Society of Materials Science, Japan. 67, 12, p. 1042-1049 8 p.

研究成果: Article

2017

On the way to the Tokyo Summer Olympic Games (2020). Prevention of severe head and neck injuries in judo: It's time for action

Kamitani, T., Malliaropoulos, N. G., Omiya, M., Otaka, Y., Inoue, K. & Onidani, N., 2017 11 1, : : British Journal of Sports Medicine. 51, 22, p. 1581-1582 2 p.

研究成果: Editorial

8 引用 (Scopus)
2016
1 引用 (Scopus)
公開
7 引用 (Scopus)

Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test

Koiwa, K., Shishido, N., Chen, C., Omiya, M., Kamiya, S., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2016 1 15, : : Scripta Materialia. 111, p. 94-97 4 p.

研究成果: Article

3 引用 (Scopus)
2015

Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

Kamiya, S., Chen, C., Shishido, N., Omiya, M., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2015 11 10, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., p. 151-153 3 p. 7325649

研究成果: Conference contribution

1 引用 (Scopus)
11 引用 (Scopus)

Scenario for catastrophic failure in interconnect structures under chip package interaction

Omiya, M., Kamiya, S., Shishido, N., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2015 5 26, IEEE International Reliability Physics Symposium Proceedings. Institute of Electrical and Electronics Engineers Inc., 巻 2015-May. p. 5C31-5C35 7112751

研究成果: Conference contribution

2014

Crack propagation resistance in thickness direction of Proton exchange membrane (PEM)

Sasaki, Y., Kai, Y., Omiya, M., Uchiyama, T. & Kumei, H., 2014 1 1, ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability. Web Portal ASME (American Society of Mechanical Engineers), (ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability).

研究成果: Conference contribution

Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer

Shishido, N., Oura, Y., Sato, H., Kamiya, S., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2014 5 25, : : Microelectronic Engineering. 120, p. 71-76 6 p.

研究成果: Article

3 引用 (Scopus)

Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects

Chen, C., Shishido, N., Kamiya, S., Koiwa, K., Sato, H., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2014 5 25, : : Microelectronic Engineering. 120, p. 52-58 7 p.

研究成果: Article

1 引用 (Scopus)

In situ observation of deformation behavior of membrane electrode assembly under humidity cycles

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kumei, H., 2014 10, : : Journal of Fuel Cell Science and Technology. 11, 5, 051006.

研究成果: Article

10 引用 (Scopus)

Local distribution of residual stress of Cu in LSI interconnect

Sato, H., Shishido, N., Kamiya, S., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T. & Nokuo, T., 2014, : : Materials Letters. 136, p. 362-365 4 p.

研究成果: Article

1 引用 (Scopus)

Specimen size effect on elastic-plastic strength evaluation of interface between thin films

Chen, C., Koiwa, K., Shishido, N., Kamiya, S., Omiya, M., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2014 12 1, : : Engineering Fracture Mechanics. 131, p. 371-381 11 p.

研究成果: Article

2 引用 (Scopus)
2013

Crack formation in membrane electrode assembly under static and cyclic loadings

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kato, M., 2013 7 22, : : Journal of Fuel Cell Science and Technology. 10, 2, 021007.

研究成果: Article

19 引用 (Scopus)

Deformation behavior of Ionic Polymer Metal Composite actuator in several pH solutions

Omiya, M. & Aoyagi, W., 2013 6 12, Electroactive Polymer Actuators and Devices (EAPAD) 2013. 868724. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 8687).

研究成果: Conference contribution

Development of cu/insulation layer interface crack extension simulation with crystal plasticity

Koiwa, K., Omiya, M., Shishido, N., Kamiya, S., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 4 1, : : Japanese journal of applied physics. 52, 4 PART 2, 04CB05.

研究成果: Article

2 引用 (Scopus)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

Omiya, M., Koiwa, K., Shishido, N., Kamiya, S., Chen, C., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 4 1, : : Microelectronics Reliability. 53, 4, p. 612-621 10 p.

研究成果: Article

5 引用 (Scopus)

Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits

Kamiya, S., Shishido, N., Watanabe, S., Sato, H., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2013 1 25, : : Surface and Coatings Technology. 215, p. 280-284 5 p.

研究成果: Article

10 引用 (Scopus)

Load transfer ustar (U*) calculation in structures under dynamic loading

Takahashi, K., Omiya, M., Iso, T., Zaiki, Y., Sakurai, T., Maki, T., Urushiyama, Y. & Naito, T., 2013, : : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 79, 807, p. 1657-1668 12 p.

研究成果: Article

公開
5 引用 (Scopus)

Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

Shishido, N., Kamiya, S., Chen, C., Sato, H., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2013 11 4, Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 6615564. (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013).

研究成果: Conference contribution

2 引用 (Scopus)
9 引用 (Scopus)

Specimen size effect of interface strength distribution induced by grain structure of Cu line

Chen, C., Shishido, N., Koiwa, K., Kamiya, S., Sato, H., Nishida, M., Omiya, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 5 6, : : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 79, 799, p. 354-358 5 p.

研究成果: Article

2012
1 引用 (Scopus)

Crack formation on membrane electrode assembly (Mea) under static and cyclic loadings

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kato, M., 2012 1 1, ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012. American Society of Mechanical Engineers (ASME), p. 143-151 9 p. (ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012).

研究成果: Conference contribution

5 引用 (Scopus)
10 引用 (Scopus)

Infrared Doppler instrument for the Subaru telescope (IRD)

Tamura, M., Suto, H., Nishikawa, J., Kotani, T., Sato, B., Aoki, W., Usuda, T., Kurokawa, T., Kashiwagi, K., Nishiyama, S., Ikeda, Y., Hall, D., Hodapp, K., Hashimoto, J., Morino, J., Inoue, S., Mizuno, Y., Washizaki, Y., Tanaka, Y., Suzuki, S. および34人, Kwon, J., Suenaga, T., Oh, D., Narita, N., Kokubo, E., Hayano, Y., Izumiura, H., Kambe, E., Kudo, T., Kusakabe, N., Ikoma, M., Hori, Y., Omiya, M., Genda, H., Fukui, A., Fujii, Y., Guyon, O., Harakawa, H., Hayashi, M., Hidai, M., Hirano, T., Kuzuhara, M., Machida, M., Matsuo, T., Nagata, T., Ohnuki, Y., Ogihara, M., Oshino, S., Suzuki, R., Takami, H., Takato, N., Takahashi, Y., Tachinami, C. & Terada, H., 2012 12 1, Ground-Based and Airborne Instrumentation for Astronomy IV. 84461T. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 8446).

研究成果: Conference contribution

39 引用 (Scopus)

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

Shishido, N., Sugiyama, H., Kamiya, S., Sato, H., Koiwa, K., Nishida, M., Omiya, M., Nagasawa, T., Nokuo, T., Suzuki, T. & Nakamura, T., 2012, : : Microscopy and Microanalysis. 18, p. 766-767 2 p.

研究成果: Article

2011

A microscopic study on local strain rate sensitivity of polypropylene syntactic foam with microballoons

Wang, E. & Omiya, M., 2011 1 11, Materials Science and Engineering Applications. p. 1280-1284 5 p. (Advanced Materials Research; 巻数 160-162).

研究成果: Conference contribution

A study on properties of ionic polymer metal composite

Kobayashi, T. & Omiya, M., 2011 1 5, Smart Materials and Intelligent Systems. p. 394-398 5 p. (Advanced Materials Research; 巻数 143-144).

研究成果: Conference contribution

4 引用 (Scopus)

Empirical equations for a study on strain rate sensitivity of polypropylene syntactic foam

Wang, E. & Omiya, M., 2011 1 5, Smart Materials and Intelligent Systems. p. 303-307 5 p. (Advanced Materials Research; 巻数 143-144).

研究成果: Conference contribution

1 引用 (Scopus)

Frequency response of IPMC actuator with palladium electrode

Kobayashi, T. & Omiya, M., 2011 5 17, Electroactive Polymer Actuators and Devices (EAPAD) 2011. 797614. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 7976).

研究成果: Conference contribution

2 引用 (Scopus)

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., Nishida, M., Nokuo, T., Nagasawa, T., Suzuki, T. & Nakamura, T., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 1).

研究成果: Conference contribution

Ionic polymer metal composite (IPMC) for MEMS actuator and sensor

Yanamori, H., Kobayashi, T. & Omiya, M., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 417-424 8 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 1).

研究成果: Conference contribution

1 引用 (Scopus)
2010
11 引用 (Scopus)

Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices

Okayama, Y., Nakahara, K., Arouette, X., Ninomiya, T., Matsumoto, Y., Orimo, Y., Hotta, A., Omiya, M. & Miki, N., 2010 9, : : Journal of Micromechanics and Microengineering. 20, 9, 095018.

研究成果: Article

26 引用 (Scopus)

Contribution of plastic dissipation to interfacial adhesion in IC metallization systems

Omiya, M., Kamiya, S., Shimomura, H. & Suzuki, T., 2010 12 1.

研究成果: Paper

9 引用 (Scopus)

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2010 12 1, Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. p. 33-38 6 p. (AIP Conference Proceedings; 巻数 1300).

研究成果: Conference contribution

6 引用 (Scopus)

Photoluminescence of cubic and monoclinic Gd2O3:Eu phosphors prepared by flame spray pyrolysis

Iwako, Y., Akimoto, Y., Omiya, M., Ueda, T. & Yokomori, T., 2010 8 1, : : Journal of Luminescence. 130, 8, p. 1470-1474 5 p.

研究成果: Article

27 引用 (Scopus)