• 744 引用
  • 12 h指数
20002020

年単位の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

研究成果

フィルター
Conference contribution
2018

Prediction of shear length in blanking process by numerical analysis

Sato, S. & Omiya, M., 2018 1 1, Technology of Plasticity. Wang, G-J., Fann, K-J., Hwang, Y-M. & Jiang, C-P. (版). Trans Tech Publications Ltd, p. 181-186 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

2015

Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

Kamiya, S., Chen, C., Shishido, N., Omiya, M., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2015 11 10, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., p. 151-153 3 p. 7325649

研究成果: Conference contribution

1 引用 (Scopus)

Scenario for catastrophic failure in interconnect structures under chip package interaction

Omiya, M., Kamiya, S., Shishido, N., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2015 5 26, IEEE International Reliability Physics Symposium Proceedings. Institute of Electrical and Electronics Engineers Inc., 巻 2015-May. p. 5C31-5C35 7112751

研究成果: Conference contribution

2014

Crack propagation resistance in thickness direction of Proton exchange membrane (PEM)

Sasaki, Y., Kai, Y., Omiya, M., Uchiyama, T. & Kumei, H., 2014 1 1, ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability. Web Portal ASME (American Society of Mechanical Engineers), (ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability).

研究成果: Conference contribution

2013

Deformation behavior of Ionic Polymer Metal Composite actuator in several pH solutions

Omiya, M. & Aoyagi, W., 2013 6 12, Electroactive Polymer Actuators and Devices (EAPAD) 2013. 868724. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 8687).

研究成果: Conference contribution

Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

Shishido, N., Kamiya, S., Chen, C., Sato, H., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2013 11 4, Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 6615564. (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013).

研究成果: Conference contribution

2 引用 (Scopus)
2012

Crack formation on membrane electrode assembly (Mea) under static and cyclic loadings

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kato, M., 2012 1 1, ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012. American Society of Mechanical Engineers (ASME), p. 143-151 9 p. (ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012).

研究成果: Conference contribution

5 引用 (Scopus)

Infrared Doppler instrument for the Subaru telescope (IRD)

Tamura, M., Suto, H., Nishikawa, J., Kotani, T., Sato, B., Aoki, W., Usuda, T., Kurokawa, T., Kashiwagi, K., Nishiyama, S., Ikeda, Y., Hall, D., Hodapp, K., Hashimoto, J., Morino, J., Inoue, S., Mizuno, Y., Washizaki, Y., Tanaka, Y., Suzuki, S. および34人, Kwon, J., Suenaga, T., Oh, D., Narita, N., Kokubo, E., Hayano, Y., Izumiura, H., Kambe, E., Kudo, T., Kusakabe, N., Ikoma, M., Hori, Y., Omiya, M., Genda, H., Fukui, A., Fujii, Y., Guyon, O., Harakawa, H., Hayashi, M., Hidai, M., Hirano, T., Kuzuhara, M., Machida, M., Matsuo, T., Nagata, T., Ohnuki, Y., Ogihara, M., Oshino, S., Suzuki, R., Takami, H., Takato, N., Takahashi, Y., Tachinami, C. & Terada, H., 2012 12 1, Ground-Based and Airborne Instrumentation for Astronomy IV. 84461T. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 8446).

研究成果: Conference contribution

39 引用 (Scopus)
2011

A microscopic study on local strain rate sensitivity of polypropylene syntactic foam with microballoons

Wang, E. & Omiya, M., 2011 1 11, Materials Science and Engineering Applications. p. 1280-1284 5 p. (Advanced Materials Research; 巻数 160-162).

研究成果: Conference contribution

A study on properties of ionic polymer metal composite

Kobayashi, T. & Omiya, M., 2011 1 5, Smart Materials and Intelligent Systems. p. 394-398 5 p. (Advanced Materials Research; 巻数 143-144).

研究成果: Conference contribution

4 引用 (Scopus)

Empirical equations for a study on strain rate sensitivity of polypropylene syntactic foam

Wang, E. & Omiya, M., 2011 1 5, Smart Materials and Intelligent Systems. p. 303-307 5 p. (Advanced Materials Research; 巻数 143-144).

研究成果: Conference contribution

Frequency response of IPMC actuator with palladium electrode

Kobayashi, T. & Omiya, M., 2011 5 17, Electroactive Polymer Actuators and Devices (EAPAD) 2011. 797614. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 7976).

研究成果: Conference contribution

2 引用 (Scopus)

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., Nishida, M., Nokuo, T., Nagasawa, T., Suzuki, T. & Nakamura, T., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 1).

研究成果: Conference contribution

Ionic polymer metal composite (IPMC) for MEMS actuator and sensor

Yanamori, H., Kobayashi, T. & Omiya, M., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 417-424 8 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 1).

研究成果: Conference contribution

1 引用 (Scopus)
2010

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2010 12 1, Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. p. 33-38 6 p. (AIP Conference Proceedings; 巻数 1300).

研究成果: Conference contribution

6 引用 (Scopus)
2009

Fabrication of ionic polymer metal composite actuator with palladium electrodes and evaluation of its bending response

Kobayashi, T., Kuribayashi, T. & Omiya, M., 2009, Active Polymers. Materials Research Society, p. 181-186 6 p. (Materials Research Society Symposium Proceedings; 巻数 1190).

研究成果: Conference contribution

Photoluminescence of cubic and monoclinic Gd 2o 3:Eu phosphors prepared by spray flame synthesis

Iwako, Y., Akimoto, Y., Omiya, M., Ueda, T. & Yokomori, T., 2009 12 1, Advances and Trends in Engineering Materials and their Applications - Proceedings of AES-ATEMA'2009 4th International Conference. p. 161-166 6 p. (AES-ATEMA International Conference Series - Advances and Trends in Engineering Materials and their Applications).

研究成果: Conference contribution

1 引用 (Scopus)
2008

Evaluation and characterization of plastics-made sheet type components under impact

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2008 1 1, Advances in Fracture and Materials Behavior - Selected, peer reviewed papers of the Seventh International Conference on Fracture and Strength of Solids (FEOFS2007). Trans Tech Publications, p. 381-386 6 p. (Advanced Materials Research; 巻数 33-37 PART 1).

研究成果: Conference contribution

Fracture of conductive ceramic thin film on polymer substrate in opto-electric devices

Omiya, M., 2008 12 1, 17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures. p. 1778-1783 6 p. (17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures; 巻数 3).

研究成果: Conference contribution

1 引用 (Scopus)

Mechanical behavior of UV irradiated glass fiber reinforced composite material

Hayabusa, K., Kudo, D., Ohtani, T., Omiya, M., Inoue, H. & Kishimoto, K., 2008 12 1, Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. p. 157-159 3 p. (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

研究成果: Conference contribution

Toughening mechanism of PP with bimodal distributed SEBS particle size

Mae, H., Omiya, M. & Kishimoto, K., 2008 12 22, Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. p. 233-239 7 p. (Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008; 巻数 1).

研究成果: Conference contribution

3 引用 (Scopus)
2007

A trial for micro-scale evaluation of adhesion strength around Cu metallization systems

Kamiya, S., Arakawa, H., Shimomura, H. & Omiya, M., 2007 1 1, Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics. Materials Research Society, p. 213-218 6 p. (Materials Research Society Symposium Proceedings; 巻数 990).

研究成果: Conference contribution

Dynamic mechanical properties of polypropylene syntactic foam with polymer microballoons

Mae, H., Omiya, M. & Kishimoto, K., 2007 1 1, Advances in Experimental Mechanics V - 5th International Conference on Advances in Experimental Mechanics. Trans Tech Publications Ltd, p. 289-294 6 p. (Applied Mechanics and Materials; 巻数 7-8).

研究成果: Conference contribution

Study on fatigue strength characteristics for solder joints

Kaneko, D., Inoue, H., Kishimoto, K., Omiya, M. & Amagai, M., 2007 12 1, EMAP 2007- International Conference on Electronic Materials and Packaging 2007. 4510302. (EMAP 2007 - International Conference on Electronic Materials and Packaging 2007).

研究成果: Conference contribution

2006

Effect of Ni plating thickness on fatigue failure of lead-free solder joints

Omiya, M., Miyazaki, T., Inoue, H., Kishimoto, K. & Amagai, M., 2006 12 1, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430655. (2006 International Conference on Electronic Materials and Packaging, EMAP).

研究成果: Conference contribution

Interfacial strength of ceramic thin film on polymer substrate

Omiya, M. & Kishimoto, K., 2006 1 1, Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture. Gdoutos, E. E. (版). Kluwer Academic Publishers, p. 83-84 2 p. (Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture).

研究成果: Conference contribution

Rubber particle size effect on impact characteristics of PC/ ABS (50/50) blends

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2006 1 1, Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture. Gdoutos, E. E. (版). Kluwer Academic Publishers, p. 505-506 2 p. (Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture).

研究成果: Conference contribution

3 引用 (Scopus)
2005

Evaluation of fatigue strength for solder joints after thermal aging

Miyazaki, T., Oomiya, M., Inoue, H., Kishimoto, K. & Amagai, M., 2005 12 1, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. p. 215-219 5 p. 1598264. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; 巻数 2005).

研究成果: Conference contribution

1 引用 (Scopus)

Fatigue crack growth in lead-free solder joints

Omiya, M., Kishimoto, K. & Amagai, M., 2005 12 1, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. p. 232-237 6 p. 1598267. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; 巻数 2005).

研究成果: Conference contribution

2002

Measurement of copper thin film adhesion by multi-stages peel test

Omiya, M., Kishimoto, K., Inoue, H. & Amagai, M., 2002 1 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 472-477 6 p. 1188885. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

6 引用 (Scopus)
2001

A mechanical reliability assessment of solder joints

Kishimoto, K., Omiya, M. & Amagai, M., 2001, Advances in Electronic Materials and Packaging 2001. Institute of Electrical and Electronics Engineers Inc., p. 8-14 7 p. 983948

研究成果: Conference contribution

5 引用 (Scopus)

Effect of intermetallic compound layer development on interfacial strength of solder joints

Omiya, M., Kishimoto, K., Shibuya, T. & Amagai, M., 2001 12 1, Advances in Electronic Packaging; Thermal Manegement Reliability. p. 1157-1164 8 p. (Advances in Electronic Packaging; 巻数 2).

研究成果: Conference contribution

1 引用 (Scopus)