• 744 引用
  • 12 h指数
20002020

年単位の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

研究成果

フィルター
Article
2020

A phase-field ductile fracture model with a variable regularization length parameter

Han, J., Nishi, S., Takada, K., Muramatsu, M., Omiya, M., Ogawa, K., Oide, K., Kobayashi, T., Murata, M., Moriguchi, S. & Terada, K., 2020, : : Transactions of the Japan Society for Computational Engineering and Science. 2020, p. 1-15 15 p., 20200005.

研究成果: Article

2019

Investigation on simplified equation for estimating J-integral of adhesive joint and its application to galvannealed steel plate+1

Ogawa, K., Maeda, R., Kobayashi, T., Yokoi, E., Furusawa, T., Takada, K. & Omiya, M., 2019 1 1, : : Materials Transactions. 60, 9, p. 1928-1935 8 p.

研究成果: Article

Modelling of intracranial behaviour on occiput impact in judo

Suzuki, R., Omiya, M., Hoshino, H., Kamitani, T. & Miyazaki, Y., 2019 1 1, : : Computer Methods in Biomechanics and Biomedical Engineering.

研究成果: Article

2018
1 引用 (Scopus)
1 引用 (Scopus)
2 引用 (Scopus)

接着継手における j 積分簡易評価式の検討と ga 鋼板への適用

Ogawa, K., Maeda, R., Kobayashi, T., Yokoi, E., Furusawa, T., Takada, K. & Omiya, M., 2018 12 1, : : Zairyo/Journal of the Society of Materials Science, Japan. 67, 12, p. 1042-1049 8 p.

研究成果: Article

2016
1 引用 (Scopus)
公開
7 引用 (Scopus)

Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test

Koiwa, K., Shishido, N., Chen, C., Omiya, M., Kamiya, S., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2016 1 15, : : Scripta Materialia. 111, p. 94-97 4 p.

研究成果: Article

3 引用 (Scopus)
2015
11 引用 (Scopus)
2014

Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer

Shishido, N., Oura, Y., Sato, H., Kamiya, S., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2014 5 25, : : Microelectronic Engineering. 120, p. 71-76 6 p.

研究成果: Article

3 引用 (Scopus)

Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects

Chen, C., Shishido, N., Kamiya, S., Koiwa, K., Sato, H., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2014 5 25, : : Microelectronic Engineering. 120, p. 52-58 7 p.

研究成果: Article

1 引用 (Scopus)

In situ observation of deformation behavior of membrane electrode assembly under humidity cycles

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kumei, H., 2014 10, : : Journal of Fuel Cell Science and Technology. 11, 5, 051006.

研究成果: Article

10 引用 (Scopus)

Local distribution of residual stress of Cu in LSI interconnect

Sato, H., Shishido, N., Kamiya, S., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T. & Nokuo, T., 2014, : : Materials Letters. 136, p. 362-365 4 p.

研究成果: Article

1 引用 (Scopus)

Specimen size effect on elastic-plastic strength evaluation of interface between thin films

Chen, C., Koiwa, K., Shishido, N., Kamiya, S., Omiya, M., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2014 12 1, : : Engineering Fracture Mechanics. 131, p. 371-381 11 p.

研究成果: Article

2 引用 (Scopus)
2013

Crack formation in membrane electrode assembly under static and cyclic loadings

Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kato, M., 2013 7 22, : : Journal of Fuel Cell Science and Technology. 10, 2, 021007.

研究成果: Article

19 引用 (Scopus)

Development of cu/insulation layer interface crack extension simulation with crystal plasticity

Koiwa, K., Omiya, M., Shishido, N., Kamiya, S., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 4 1, : : Japanese journal of applied physics. 52, 4 PART 2, 04CB05.

研究成果: Article

2 引用 (Scopus)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

Omiya, M., Koiwa, K., Shishido, N., Kamiya, S., Chen, C., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 4 1, : : Microelectronics Reliability. 53, 4, p. 612-621 10 p.

研究成果: Article

5 引用 (Scopus)

Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits

Kamiya, S., Shishido, N., Watanabe, S., Sato, H., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2013 1 25, : : Surface and Coatings Technology. 215, p. 280-284 5 p.

研究成果: Article

10 引用 (Scopus)

Load transfer ustar (U*) calculation in structures under dynamic loading

Takahashi, K., Omiya, M., Iso, T., Zaiki, Y., Sakurai, T., Maki, T., Urushiyama, Y. & Naito, T., 2013, : : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 79, 807, p. 1657-1668 12 p.

研究成果: Article

公開
5 引用 (Scopus)
9 引用 (Scopus)

Specimen size effect of interface strength distribution induced by grain structure of Cu line

Chen, C., Shishido, N., Koiwa, K., Kamiya, S., Sato, H., Nishida, M., Omiya, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2013 5 6, : : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 79, 799, p. 354-358 5 p.

研究成果: Article

2012
1 引用 (Scopus)
10 引用 (Scopus)

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

Shishido, N., Sugiyama, H., Kamiya, S., Sato, H., Koiwa, K., Nishida, M., Omiya, M., Nagasawa, T., Nokuo, T., Suzuki, T. & Nakamura, T., 2012, : : Microscopy and Microanalysis. 18, p. 766-767 2 p.

研究成果: Article

2011
1 引用 (Scopus)
2010
11 引用 (Scopus)

Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices

Okayama, Y., Nakahara, K., Arouette, X., Ninomiya, T., Matsumoto, Y., Orimo, Y., Hotta, A., Omiya, M. & Miki, N., 2010 9, : : Journal of Micromechanics and Microengineering. 20, 9, 095018.

研究成果: Article

26 引用 (Scopus)
9 引用 (Scopus)

Photoluminescence of cubic and monoclinic Gd2O3:Eu phosphors prepared by flame spray pyrolysis

Iwako, Y., Akimoto, Y., Omiya, M., Ueda, T. & Yokomori, T., 2010 8 1, : : Journal of Luminescence. 130, 8, p. 1470-1474 5 p.

研究成果: Article

27 引用 (Scopus)
2009
2008

A novel evaluation method for interfacial adhesion strength in ductile dissimilar materials

Kamiya, S., Furuta, H., Omiya, M. & Shimomura, H., 2008 12 1, : : Engineering Fracture Mechanics. 75, 18, p. 5007-5017 11 p.

研究成果: Article

9 引用 (Scopus)
12 引用 (Scopus)
1 引用 (Scopus)
2 引用 (Scopus)
36 引用 (Scopus)

High deformation rate and failure characteristics of amorphous polymers and their blends

Machmud, M. N., Mochizuki, D., Omiya, M., Inoue, H. & Kishimoto, K., 2008 6 15, : : Materials Science and Engineering A. 483-484, 1-2 C, p. 242-244 3 p.

研究成果: Article

1 引用 (Scopus)
11 引用 (Scopus)
20 引用 (Scopus)

Tensile stress strain behavior of polypropylene toughened with Bi-modal SEBS

Mae, H., Omiya, M. & Kishimoto, K., 2008 4 30, : : International Journal of Modern Physics B. 22, 9-11, p. 1129-1134 6 p.

研究成果: Article

3 引用 (Scopus)
2007

Adhesion energy of Cu/polyimide interface in flexible printed circuits

Kamiya, S., Furuta, H. & Omiya, M., 2007 12 15, : : Surface and Coatings Technology. 202, 4-7, p. 1084-1088 5 p.

研究成果: Article

35 引用 (Scopus)

Deformation and failure behaviors of PC/ABS (50/50) blends under impact

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2007 1 1, : : Key Engineering Materials. 340-341 I, p. 319-324 6 p.

研究成果: Article

Effect of peel rate on interfacial strength

Masuda, R., Omiya, M., Inoue, H. & Kishimoto, K., 2007 1 1, : : Key Engineering Materials. 345-346 I, p. 185-188 4 p.

研究成果: Article

2 引用 (Scopus)
2006

A phenomenological constitutive model constructed for PC/ABS blends

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2006 1 1, : : Key Engineering Materials. 306-308 II, p. 989-994 6 p.

研究成果: Article

7 引用 (Scopus)
2005

A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

Jeon, I., Omiya, M., Inoue, H., Kishimoto, K. & Asahina, T., 2005 1 1, : : Key Engineering Materials. 297-300 I, p. 521-526 6 p.

研究成果: Article

Fracture of brittle thin film on polymer substrate

Omiya, M. & Kishimoto, K., 2005 12 1, : : Theoretical and Applied Mechanics Japan. 54, p. 93-99 7 p.

研究成果: Article

Impact behavior analysis of PC/ABS (50/50) blends

Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2005 1 1, : : Key Engineering Materials. 297-300 II, p. 1297-1302 6 p.

研究成果: Article

3 引用 (Scopus)