320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM

Naoaki Yamanaka, Ken ichi Endo, Kouichi Genda, Hideki Fukuda, Tohru Kishimoto, Shin ichi Sasaki

研究成果: Conference contribution

11 被引用数 (Scopus)

抄録

This paper describes a 320 Gb/s high-speed multi-chip ATM switching system for broadband ISDN. This system employs a Copper-polyimide MCM with 4-layer copper-polyimide signal transmission layers and 15-layer ceramic power supply layers. The system uses 64 MCMs that are interconnected by 98-highway flexible printed circuit connector. Si-bipolar VLSIs are mounted on MCM using the 150 μm very-thin pitch outer lead TAB technique. In addition, a high-performance heat-pipe air cooling technique is adopted. The system switches ATM cells up to 320 Gb/s throughput and it is applicable for future B-ISDN.

本文言語English
ホスト出版物のタイトルProceedings - Electronic Components and Technology Conference
出版社Publ by IEEE
ページ776-785
ページ数10
ISBN(印刷版)0780309154
出版ステータスPublished - 1994 1 1
外部発表はい
イベントProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference - Washington, DC, USA
継続期間: 1994 5 11994 5 4

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Other

OtherProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference
CityWashington, DC, USA
Period94/5/194/5/4

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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